Three-dimensional hybrid bonding integration challenges and solutions toward multi-wafer stacking
Arnaud, L., Karam, C., Bresson, N., Dubarry, C., Borel, S., Assous, M., Mauguen, G., Fournel, F., Gottardi, M., Mourier, T., Cheramy, S., Servant, F.
Published in MRS communications (01.12.2020)
Published in MRS communications (01.12.2020)
Get full text
Journal Article
Electron magnetoresistance mobility in silicon-on-insulator layers using Kelvin’s technique
Antoszewski, J., Dell, J.M., Faraone, L., Bresson, N., Cristoloveanu, S.
Published in Solid-state electronics (01.09.2010)
Published in Solid-state electronics (01.09.2010)
Get full text
Journal Article
Conference Proceeding
Innovating SOI films: impact of thickness and temperature
Get full text
Journal Article
Conference Proceeding
Detailed investigation of geometrical factor for pseudo-MOS transistor technique
Komiya, K., Bresson, N., Shingo Sato, Cristoloveanu, S., Omura, Y.
Published in IEEE transactions on electron devices (01.03.2005)
Published in IEEE transactions on electron devices (01.03.2005)
Get full text
Journal Article
Through Silicon Via technology using tungsten metallization
Pares, G, Bresson, N, Minoret, S, Lapras, V, Brianceau, P, Lugand, J F, Anciant, R, Sillon, N
Published in 2011 IEEE International Conference on IC Design & Technology (01.05.2011)
Published in 2011 IEEE International Conference on IC Design & Technology (01.05.2011)
Get full text
Conference Proceeding
Die to Wafer Direct Hybid Bonding Demonstration with High Alignment Accuracy and Electrical Yields
Jouve, A., Sanchez, L., Castan, C., Bresson, N., Fournel, F., Raynaud, N., Metzger, P.
Published in 2019 International 3D Systems Integration Conference (3DIC) (01.10.2019)
Published in 2019 International 3D Systems Integration Conference (3DIC) (01.10.2019)
Get full text
Conference Proceeding
3D interconnection using copper direct hybrid bonding for GaN on silicon wafer
Dubarry, C., Arnaud, L., Munoz, M. L. Calvo, Mauguen, G., Moreau, S., Crochemore, R., Bresson, N., Aventurier, B.
Published in 2021 IEEE International 3D Systems Integration Conference (3DIC) (01.10.2021)
Published in 2021 IEEE International 3D Systems Integration Conference (3DIC) (01.10.2021)
Get full text
Conference Proceeding
Charge trapping in irradiated SOI wafers measured by second harmonic generation
Bongim Jun, Schrimpf, R.D., Fleetwood, D.M., White, Y.V., Pasternak, R., Rashkeev, S.N., Brunier, F., Bresson, N., Fouillat, M., Cristoloveanu, S., Tolk, N.H.
Published in IEEE transactions on nuclear science (01.12.2004)
Published in IEEE transactions on nuclear science (01.12.2004)
Get full text
Journal Article
Ultra-thin strained SOI substrate analysis by pseudo-MOS measurements
Gallon, C., Fenouillet-Beranger, C., Bresson, N., Cristoloveanu, S., Allibert, F., Bord, S., Aulnette, C., Delille, D., Latu-Romain, E., Hartmann, J.M., Ernst, T., Andrieu, F., Campidelli, Y., Ghyselen, B., Cayrefourcq, I., Fournel, F., Kernevez, N., Skotnicki, T.
Published in Microelectronic engineering (01.06.2005)
Published in Microelectronic engineering (01.06.2005)
Get full text
Journal Article
Conference Proceeding
Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development
Bourjot, E., Stewart, P., Dubarry, C., Lagoutte, E., Rolland, E., Bresson, N., Romano, G., Scevola, D., Balan, V., Dechamp, J., Zussy, M., Mauguen, G., Castan, C., Sanchez, L., Jouve, A., Fournel, F., Cheramy, S.
Published in 2019 International 3D Systems Integration Conference (3DIC) (01.10.2019)
Published in 2019 International 3D Systems Integration Conference (3DIC) (01.10.2019)
Get full text
Conference Proceeding
Effects of stress in polysilicon VIA - first TSV technology
Parès, G, Bresson, N, Moreau, S, Lapras, V, Henry, D, Sillon, N
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
Get full text
Conference Proceeding
Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability
Arnaud, L., Moreau, S., Jouve, A., Jani, I., Lattard, D., Fournel, F., Euvrard, C., Exbrayat, Y., Balan, V., Bresson, N., Lhostis, S., Jourdon, J., Deloffre, E., Guillaumet, S., Farcy, A., Gousseau, S., Arnoux, M.
Published in 2018 IEEE International Reliability Physics Symposium (IRPS) (01.03.2018)
Published in 2018 IEEE International Reliability Physics Symposium (IRPS) (01.03.2018)
Get full text
Conference Proceeding
Effect of passivation annealing on the electromigration properties of hybrid bonding stack
Jourdon, J., Moreau, S., Bouchu, D., Lhostis, S., Bresson, N., Guiheux, D., Beneyton, R., Renard, S., Fremont, H.
Published in 2017 IEEE International Reliability Physics Symposium (IRPS) (01.04.2017)
Published in 2017 IEEE International Reliability Physics Symposium (IRPS) (01.04.2017)
Get full text
Conference Proceeding
Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness
Jourdon, J., Lhostis, S., Moreau, S., Chossat, J., Arnoux, M., Sart, C., Henrion, Y., Lamontagne, P., Arnaud, L., Bresson, N., Balan, V., Euvrard, C., Exbrayat, Y., Scevola, D., Deloffre, E., Mermoz, S., Martin, A., Bilgen, H., Andre, F., Charles, C., Bouchu, D., Farcy, A., Guillaumet, S., Jouve, A., Fremont, H., Cheramy, S.
Published in 2018 IEEE International Electron Devices Meeting (IEDM) (01.12.2018)
Published in 2018 IEEE International Electron Devices Meeting (IEDM) (01.12.2018)
Get full text
Conference Proceeding