Monolithic Thin Wafer Stacking Using Low Temperture Direct Bonding
Burggraf, Jürgen, Bravin, Julian, Wiesbauer, Harald, Dragoi, Viorel
Published in ECS transactions (14.08.2014)
Published in ECS transactions (14.08.2014)
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Journal Article
Delamination Root Cause in Temporary Bonding
Vial, Karine, Fournel, Frank, Wimplinger, Markus, Burggraf, Jürgen, Bravin, Julian, Montméat, Pierre, Pellat, Michel
Published in ECS transactions (14.08.2014)
Published in ECS transactions (14.08.2014)
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Journal Article
Low Temperature Wafer Bonding for 3D Applications
Burggraf, Juergen, Bravin, Julian, Wiesbauer, Harald, Dragoi, Viorel
Published in ECS transactions (27.02.2014)
Published in ECS transactions (27.02.2014)
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Journal Article
IR Laser Release for 3D Stacked Devices: Effect of the Release Stack Structure on the Debonding Mechanism
Chancerel, Francois, Urban, Peter, Slabbekoorn, John, Halas, Simon, Bravin, Julian, Brems, Steven, Uhrmann, Thomas, Wimplinger, Markus, Phommahaxay, Alain, Beyne, Eric
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Laser Debonding Enabling Ultra-Thin Fan-Out WLP Devices
Uhrmann, Thomas, Pichler, Matthias, Bravin, Julian, Burgstaller, Daniel, Povazay, Boris
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
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Conference Proceeding
Ultra-Thin QFN-Like 3D Package with 3D Integrated Passive Devices
Ghannam, Ayad, van Haare, Niek, Bravin, Julian, Brandl, Elisabeth, Brandstatter, Birgit, Klingler, Hannes, Auer, Benedikt, Meunier, Philippe, Kersjes, Sebastiaan
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding
Monolithic Thin Wafer Stacking Using Low Temperture Direct Bonding
Burggraf, Jürgen, Bravin, Julian, Wiesbauer, Harald, Dragoi, Viorel
Published in Meeting abstracts (Electrochemical Society) (05.08.2014)
Published in Meeting abstracts (Electrochemical Society) (05.08.2014)
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Journal Article
Low Temperature Fusion Wafer Bonding for Wafer-Level 3D Integration Applications
Burggraf, Juergen, Bravin, Julian, Wiesbauer, Harald, Dragoi, Viorel
Published in Meeting abstracts (Electrochemical Society) (27.10.2013)
Published in Meeting abstracts (Electrochemical Society) (27.10.2013)
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Journal Article
Temporary bonding on the move towards high volume: A status update on cost-of-ownership
Uhrmann, Thomas, Burggraf, Jurgen, Wiesbauer, Harald, Bravin, Julian, Matthias, Thorsten, Wimplinger, Markus, Lindner, Paul
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
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Conference Proceeding
Wafer edge defect study of temporary bonded and thin wafers in TSV process flow
Jie Gong, Sood, Sumant, Bhat, Rohit, Jahanbin, Sina, Aji, Prashant, Uhrmann, Thomas, Bravin, Julian, Burggraf, Jurgen, Wimplinger, Markus, Lindner, Paul
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding
Delamination Root Cause in Temporary Bonding
Vial, Karine, Fournel, Frank, Wimplinger, Markus, Burggraf, Jürgen, Bravin, Julian, Montméat, Pierre, Pellat, Michel
Published in Meeting abstracts (Electrochemical Society) (05.08.2014)
Published in Meeting abstracts (Electrochemical Society) (05.08.2014)
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Journal Article
Versatile thin wafer stacking technology for monolithic integration of temporary bonded thin wafers
Uhrmann, Thomas, Burggraf, Jurgen, Bravin, Julian, Dragoi, Viorel, Wimplinger, Markus, Matthias, Thorsten, Lindner, Paul
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
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Conference Proceeding
An innovative and low cost Bi-layer method for temporary bonding
Burggraf, Jurgen, Wiesbauer, Harald, Bravin, Julian, Uhrmann, Thomas, Meynen, Herman, Civale, Yann, John, Ranjith, Sheng Wang, Peng-Fei Fu, Yeakle, Craig
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
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Conference Proceeding