Profile simulation of conformality of chemical vapor deposited copper in subquarter-micron trench and via structures
Burke, Aaron, Braeckelmann, Gregory, Manger, Dirk, Eisenbraun, Eric, Kaloyeros, Alain E., McVittie, Jim P., Han, Joseph, Bang, David, Loan, James F., Sullivan, John J.
Published in Journal of applied physics (01.11.1997)
Published in Journal of applied physics (01.11.1997)
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Journal Article
In Situ Mass Spectral and Infrared Studies of the Gas‐Phase Evolution and Decomposition Pathways of Cu II ( hfac ) 2 : Application in the Development of Plasma‐Assisted Chemical Vapor Deposition of Copper
Zheng, Bo, Braeckelmann, Gregory, Kujawski, Kelly, Lou, Ishing, Lane, Sarah, Kaloyeros, Alain E.
Published in Journal of the Electrochemical Society (01.11.1995)
Published in Journal of the Electrochemical Society (01.11.1995)
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Journal Article