N-halamine surface coating for mitigation of biofilm and microbial contamination in water systems for space travel
Demir, Buket, Taylor, Alicia, Broughton, R.M., Huang, T.-S., Bozack, M.J., Worley, S.D.
Published in Biofilm (01.12.2022)
Published in Biofilm (01.12.2022)
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Journal Article
Influence of Substrate Surface Roughness on Tin Whisker Growth
Rodekohr, C.L., Flowers, G.T., Suhling, J.C., Bozack, M.J.
Published in 2008 Proceedings of the 54th IEEE Holm Conference on Electrical Contacts (01.10.2008)
Published in 2008 Proceedings of the 54th IEEE Holm Conference on Electrical Contacts (01.10.2008)
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Conference Proceeding
A study of the physical characteristics of vibration-induced fretting corrosion
Flowers, G.T., Fei Xie, Bozack, M.J., Xin Hai, Rickett, B.I., Malucci, R.D.
Published in IEEE transactions on components and packaging technologies (01.06.2006)
Published in IEEE transactions on components and packaging technologies (01.06.2006)
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Journal Article
The Influence of Elevated Temperature Aging on Reliability of Lead Free Solder Joints
Hongtao Ma, Suhling, J.C., Yifei Zhang, Lall, P., Bozack, M.J.
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.01.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.01.2007)
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Conference Proceeding
Vibration thresholds for fretting corrosion in electrical connectors
Flowers, G.T., Fei Xie, Bozack, M.J., Malucci, R.D.
Published in IEEE transactions on components and packaging technologies (01.03.2004)
Published in IEEE transactions on components and packaging technologies (01.03.2004)
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Journal Article
Wetting characteristics of Pb-free solder alloys and PWB finishes
Sattiraju, S.V., Bing Dang, Johnson, R.W., Yali Li, Smith, J.S., Bozack, M.J.
Published in IEEE transactions on electronics packaging manufacturing (01.07.2002)
Published in IEEE transactions on electronics packaging manufacturing (01.07.2002)
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Journal Article
Polymeric Antimicrobial N‑Halamine-Surface Modification of Stainless Steel
Demir, Buket, Broughton, R. M, Huang, T. S, Bozack, M. J, Worley, S. D
Published in Industrial & engineering chemistry research (18.10.2017)
Published in Industrial & engineering chemistry research (18.10.2017)
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Journal Article
Si-F bond directions on Si(100) — A study by ESDIAD
Bozack, M.J., Dresser, M.J., Choyke, W.J., Taylor, P.A., Yates, J.T.
Published in Surface science (01.05.1987)
Published in Surface science (01.05.1987)
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Journal Article
Auger Electron Spectroscopic (AES) Measurements on High Aspect Ratio Tin Whiskers
Rodekohr, C.L., Flowers, G.T., Suhling, J.C., Bozack, M.J.
Published in 2008 Proceedings of the 54th IEEE Holm Conference on Electrical Contacts (01.10.2008)
Published in 2008 Proceedings of the 54th IEEE Holm Conference on Electrical Contacts (01.10.2008)
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Conference Proceeding
Chemical activity of the C=C double bond on silicon surfaces
Bozack, M.J., Taylor, P.A., Choyke, W.J., Yates, J.T.
Published in Surface science letters (01.11.1986)
Published in Surface science letters (01.11.1986)
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Journal Article
The effects of aging temperature on SAC solder joint material behavior and reliability
Yifei Zhang, Zijie Cai, Suhling, J.C., Lall, P., Bozack, M.J.
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding