Polymeric Antimicrobial N‑Halamine-Surface Modification of Stainless Steel
Demir, Buket, Broughton, R. M, Huang, T. S, Bozack, M. J, Worley, S. D
Published in Industrial & engineering chemistry research (18.10.2017)
Published in Industrial & engineering chemistry research (18.10.2017)
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Influence of Surface Segregation on Wetting of Sn-Ag-Cu (SAC) Series and Pb-Containing Solder Alloys
Bozack, M. J., Suhling, J. C., Zhang, Y., Cai, Z., Lall, P.
Published in Journal of electronic materials (01.10.2011)
Published in Journal of electronic materials (01.10.2011)
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Journal Article
N-halamine surface coating for mitigation of biofilm and microbial contamination in water systems for space travel
Demir, Buket, Taylor, Alicia, Broughton, R.M., Huang, T.-S., Bozack, M.J., Worley, S.D.
Published in Biofilm (01.12.2022)
Published in Biofilm (01.12.2022)
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High temperature stability of chromium boride ohmic contacts to p-type 6H-SiC
Oder, T. N., Williams, J. R., Bozack, M. J., Iyer, V., Mohney, S. E., Crofton, J.
Published in Journal of electronic materials (01.04.1998)
Published in Journal of electronic materials (01.04.1998)
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Growth of Sn Whiskers on Semiconductor and Insulator Surfaces
Crandall, E R, Flowers, G T, Dean, R N, Bozack, M J
Published in 2010 Proceedings of the 56th IEEE Holm Conference on Electrical Contacts (01.10.2010)
Published in 2010 Proceedings of the 56th IEEE Holm Conference on Electrical Contacts (01.10.2010)
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Conference Proceeding
Oxidation-Induced Growth of Sn Whiskers in a Pure Oxygen Gas Environment
Crandall, E R, Flowers, G T, Dean, R N, Bozack, M J
Published in 2010 Proceedings of the 56th IEEE Holm Conference on Electrical Contacts (01.10.2010)
Published in 2010 Proceedings of the 56th IEEE Holm Conference on Electrical Contacts (01.10.2010)
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Conference Proceeding
Effects of Isothermal Aging on the Thermal Expansion of Several Sn-Based Lead-Free Solder Alloys
Hasnine, M., Bozack, M. J.
Published in Journal of materials engineering and performance (01.03.2018)
Published in Journal of materials engineering and performance (01.03.2018)
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Physical characterization of Pb1Zr0.2Ti0.8O3 prepared by the sol-gel process
BOZACK, M. J, WILLIAMS, J. R, FERRARO, J. M, FENG, Z. C, JONES, R. E
Published in Journal of the Electrochemical Society (01.02.1995)
Published in Journal of the Electrochemical Society (01.02.1995)
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The Effects of Surface Finish Roughness on Intermetallic Layer Growth, Intermetallic Interface Roughness, and Solder Joint Reliability
Rodekohr, C L, Bozack, M J, Flowers, G T, Suhling, J C, Rodekohr, D A
Published in 2010 Proceedings of the 56th IEEE Holm Conference on Electrical Contacts (01.10.2010)
Published in 2010 Proceedings of the 56th IEEE Holm Conference on Electrical Contacts (01.10.2010)
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Conference Proceeding
Influence of surface segregation on wetting of liquid metal alloys
Bozack, M. J, Bell, A. E, Swanson, L. W
Published in Journal of physical chemistry (1952) (01.06.1988)
Published in Journal of physical chemistry (1952) (01.06.1988)
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