by Bécan, G, Philippe, H, Phung, J, Boutaud, B, Woytasik, M, Bouville, D, Lefeuvre, E
Published in Journal of micromechanics and microengineering (01.09.2021)

by Laudrel, E, Tillocher, T, Meric, Y, Lefaucheux, P, Boutaud, B, Dussart, R
Published in Journal of micromechanics and microengineering (08.03.2018)

by Tillocher, T, Lefaucheux, P, Boutaud, B, Dussart, R
Published in Journal of micromechanics and microengineering (01.07.2014)

by Maaroufi, S, Parrain, F, Lefeuvre, E, Boutaud, B, Molin, R Dal
Published in Journal of physics. Conference series (10.12.2015)

by Becan, G., Bosseboeuf, A., Phung, J., Philippe, H., Boutaud, B., Woytasik, M., Coste, P., Lefeuvre, E.
Published in 2021 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) (25.08.2021)

by Becan, G., Philippe, H., Phung, J., Laudrel, E., Boutaud, B., Isac, N., Woytasik, M., Lefeuvre, E.
Published in 2020 14th International Symposium on Medical Information Communication Technology (ISMICT) (01.05.2020)

by Becan, G., Phung, J., Philippe, H., Bosseboeuf, A., Coste, P., Laudrel, E., Boutaud, B., Woytasik, M., Lefeuvre, E.
Published in 2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) (01.06.2020)

by Deterre, M., Lefeuvre, E., Zhu, Y., Woytasik, M., Bosseboeuf, A., Boutaud, B., Dal Molin, R.
Published in 2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS) (01.01.2013)

by Laudrel, E, Tillocher, T, Meric, Y, Lefaucheux, P, Boutaud, B, Dussart, R
Published in Journal of micromechanics and microengineering (01.05.2018)

by Lefeuvre, E., Risquez, S., Woytasik, M., Deterre, M., Boutaud, B., Dal Molin, R.
Published in 2013 25th International Conference on Microelectronics (ICM) (01.12.2013)

by Souriau, Jean-Charles, Herrera Morales, Jorge Mario, Castagné, Laetitia, Simon, Gilles, Amara, Karima, Boutaud, Bertrand
Published in ECS transactions (10.09.2015)

by Souriau, J-C., Morales, J. M. Herrera, Castagné, L., Simon, G., Amara, K., Boutaud, B.
Published in ECS journal of solid state science and technology (01.01.2015)

by Riahi, S., Becan, G., Ammar, M., Bosseboeuf, A., Laourine, F., Boutaud, B., Bouville, D., Harouri, A., Coste, P., Lefeuvre, E.
Published in 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (02.06.2024)

by Boutaud, B, Laville, J-M
Published in Revue de chirurgie orthopédique et réparatrice de l'apparell moteur (01.06.2004)

by Deterre, M., Boutaud, B., Dalmolin, R., Boisseau, S., Chaillout, J-J, Lefeuvre, E., Dufour-Gergam, E.
Published in 2011 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP) (01.05.2011)