A 3-D stacked chip packaging solution for miniaturized massively parallel processing
Lea, R.M., Jalowiecki, I.P., Boughton, D.K., Yamaguchi, J.S., Pepe, A.A., Ozguz, V.H., Carson, J.C.
Published in IEEE transactions on advanced packaging (01.08.1999)
Published in IEEE transactions on advanced packaging (01.08.1999)
Get full text
Journal Article
Conference Proceeding