Process Design Kit and Initial Demonstration of Digital Metal-Embedded Chip Assembly for High Density IO Fan-Out Packaging
Nadri, Souheil, Tu, B-A. Clayton, Herrault, Florian, Sharifi, Hasan, McCue, Jamin, Khan, Abdullah, Schwan, David, Botticello, David, Das, Sanjana, Kuzmenko, Daniel, Wong, Joel, Phan, Vu, Nguyen, Jason, Wilt, Courtney
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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