High resolution microstructural investigation of leadfree Aluminium-Germanium and Aluminum-Germanium-Copper alloys for high temperature silicon die attach
Klengel, S., Bottge, B., Petzold, M., Schneider, W.
Published in 18th European Microelectronics & Packaging Conference (01.09.2011)
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Published in 18th European Microelectronics & Packaging Conference (01.09.2011)
Conference Proceeding
Temperature dependent fracture toughness of glass frit bonding layers
Notzold, K., Dresbach, C., Graf, J., Bottge, B.
Published in 2009 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (01.04.2009)
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Published in 2009 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (01.04.2009)
Conference Proceeding
Anchoring Adolescents' Understanding of Math Concepts in Rich Problem-Solving Environments
Bottge, Brian A., Heinrichs, Mary, Chan, Shih-Yi, Serlin, Ronald C.
Published in Remedial and special education (01.09.2001)
Published in Remedial and special education (01.09.2001)
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Journal Article
The Computer Doesn't Embarrass Me
Hasselbring, Ted S, Goin, Laura, Taylor, Rose, Bottge, Brian, Daley, Partick
Published in Educational Leadership (01.11.1997)
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Published in Educational Leadership (01.11.1997)
Magazine Article
Trade Publication Article
Using Intriguing Problems To Improve Math Skills
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Magazine Article
Trade Publication Article