Thermomechanical reliability of gold stud bump bonding for large volume MEMS devices
Visser Taklo, Maaike M., Wright, Daniel Nilsen, Vardoy, Astrid-Sofie, Attard, Alastair, Hajdarevic, Zlatko, Bulacher, Stephan, Saliba, Mario, Wijgaerts, Jan, Borg, Joshua, Vella, David Oscar
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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