Highlighting two integration technologies based on vias: Through silicon vias and embedded components into PCB. Strengths and weaknesses for manufacturing and reliability
Balmont, M., Bord Majek, I., Poupard, B., Bechou, L., Ousten, Y.
Published in Microelectronics and reliability (01.09.2018)
Published in Microelectronics and reliability (01.09.2018)
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Journal Article
Liquid Crystal Polymer for QFN packaging: Predicted thermo-mechanical fatigue and Design for Reliability
Chenniki, Walide, Bord-Majek, Isabelle, Louarn, Mélanie, Gaud, Vincent, Diot, Jean-Luc, Wongtimnoi, Komkrisd, Ousten, Yves
Published in Microelectronics and reliability (01.12.2015)
Published in Microelectronics and reliability (01.12.2015)
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Journal Article
Operational Performances Demonstration of Polymer-Ceramic Embedded Capacitors for MMIC Applications
Bord-Majek, I., Kertesz, P., Mazeau, J., Caban-Chastas, D., Levrier, B., Bechou, L., Ousten, Y.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2011)
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Journal Article
Ba1−xSrxTiO3 (x =0.4) nanoparticles dispersion for 3D integration of decoupling capacitors on glass interposer
Tetsi, E., Philippot, G., Majek, I. Bord, Aymonier, C., Audet, J., Bechou, L., Drouin, D.
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
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Conference Proceeding
High frequency characterization of nanocomposite materials based on simulation and measurement of buried capacitors
Wade, Massar, Duchamp, Genevieve, Dubois, Tristan, Majek, Isabelle Bord
Published in 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2016)
Published in 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2016)
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Conference Proceeding