Reconfigurable mosaic annular arrays
Thomenius, Kai, Wodnicki, Robert, Cogan, Scott, Fisher, Rayette, Burdick, Bill, Smith, L., Khuri-Yakub, Pierre, Der-Song Lin, Xuefeng Zhuang, Bonitz, Barry, Davies, Todd, Thomas, Glen, Woychik, Charles
Published in IEEE transactions on ultrasonics, ferroelectrics, and frequency control (01.07.2014)
Published in IEEE transactions on ultrasonics, ferroelectrics, and frequency control (01.07.2014)
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Journal Article
Packaging and modular assembly of large-area and fine-pitch 2-D ultrasonic transducer arrays
Lin, Der-Song, Khuri-Yakub, Pierre, Bonitz, Barry, Davies, Todd, Thomas, Glen, Otto, Bernd, Töpper, Michael, Fritzsch, Thomas, Ehrmann, Oswin, Wodnicki, Robert, Zhuang, Xuefeng, Woychik, Charles, Thomenius, Kai E., Fisher, Rayette A., Mills, David M., Byun, Albert J., Burdick, William
Published in IEEE transactions on ultrasonics, ferroelectrics, and frequency control (01.07.2013)
Published in IEEE transactions on ultrasonics, ferroelectrics, and frequency control (01.07.2013)
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Journal Article
Package-Interposer-Package (PIP): A breakthrough Package-on-Package (PoP) technology for high end electronics
Das, R. N., Egitto, F. D., Bonitz, B., Poliks, M. D., Markovich, V. R.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
3D-interconnect approach for high end electronics
Das, R. N., Egitto, F. D., Lauffer, J., Bonitz, B., Wilson, B., Marconi, F., Poliks, M. D., Markovich, V. R.
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
Electronic package assembly with protective encapsulant material
MEMIS, IRVING, VETTEL, GERALD MICHAEL, BONITZ, BARRY ALAN, KAPUR, KISHEN NARAIN, MCCREARY, JACK MARLYN, ELLERSON, JAMES VERNON
Year of Publication 11.06.1997
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Year of Publication 11.06.1997
Patent
Method of making an electronic package assembly with protective encapsulant material
ELLERSON; JAMES V, VETTEL; GERALD M, BONITZ; BARRY A, KAPUR; KISHEN N, MCCREARY; JACK M, MEMIS; IRVING
Year of Publication 16.05.1995
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Year of Publication 16.05.1995
Patent
Electronic package assembly with protective encapsulant material
MEMIS, IRVING, VETTEL, GERALD MICHAEL, BONITZ, BARRY ALAN, KAPUR, KISHEN NARAIN, MCCREARY, JACK MARLYN, ELLERSON, JAMES VERNON
Year of Publication 16.06.1993
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Year of Publication 16.06.1993
Patent