Stress-induced voiding under vias connected to wide Cu metal leads
Ogawa, E.T., McPherson, J.W., Rosal, J.A., Dickerson, K.J., Chiu, T.-C., Tsung, L.Y., Jain, M.K., Bonifield, T.D., Ondrusek, J.C., McKee, W.R.
Published in 2002 IEEE International Reliability Physics Symposium. Proceedings. 40th Annual (Cat. No.02CH37320) (2002)
Published in 2002 IEEE International Reliability Physics Symposium. Proceedings. 40th Annual (Cat. No.02CH37320) (2002)
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Conference Proceeding
Characterization of Defect Formation during Ni Silicidation for CMOS Device Application
Ko, K-S, Crank, S, Chen, P, Yue, D, Lavangkul, S, Mogul, H, Siddiqui, S, Bonifield, T
Published in Microscopy and microanalysis (01.08.2005)
Published in Microscopy and microanalysis (01.08.2005)
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Journal Article
Hydrogen passivation of PolySilicon MOSFET's from a plasma Nitride source
Pollack, G.P., Richardson, W.F., Malhi, S.D.S., Bonifield, T., Shichijo, H., Banerjee, S., Elahy, M., Shah, A.H., Womack, R., Chatterjee, P.K.
Published in IEEE electron device letters (01.11.1984)
Published in IEEE electron device letters (01.11.1984)
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Journal Article
Edge-defined self-alignment of submicrometer overlaid devices
Malhi, S.D.S., Chatterjee, P.K., Bonifield, T.D., Leiss, J.E., Carter, D.E., Pinizzotto, R.F., Coleman, D.J.
Published in IEEE electron device letters (01.10.1984)
Published in IEEE electron device letters (01.10.1984)
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Journal Article
A systematic approach to interconnect modeling and process monitoring
Nagaraj, N.S., Kulkarni, M., Bonifield, T., Usha Narasimha, Hossain, I., Zabierek, C.
Published in Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) (2003)
Published in Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) (2003)
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Conference Proceeding
Benchmarks for interconnect parasitic resistance and capacitance
Nagaraj, N.S., Bonifield, T., Singh, A., Cano, F., Narasimha, U., Kulkarni, M., Balsara, P., Cantrell, C.
Published in Fourth International Symposium on Quality Electronic Design, 2003. Proceedings (2003)
Published in Fourth International Symposium on Quality Electronic Design, 2003. Proceedings (2003)
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Conference Proceeding
Collisional mixing of the lowest bound molecular states in xenon and argon
Keto, J.W., Gleason, R.E., Bonifield, T.D., Walters, G.K., Soley, F.K.
Published in Chemical physics letters (01.08.1976)
Published in Chemical physics letters (01.08.1976)
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Journal Article
BEOL variability and impact on RC extraction
Nagaraj, N.S., Bonifield, T., Singh, A., Bittlestone, C., Narasimha, U., Le, V., Hill, A.
Published in Proceedings. 42nd Design Automation Conference, 2005 (2005)
Published in Proceedings. 42nd Design Automation Conference, 2005 (2005)
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Conference Proceeding
Failure Mode Detection and Process Optimization for 65 nm CMOS Technology
DeBord, J.R.D., Olsen, L., Jin Zhao, Bonifield, T., Lytle, S.
Published in 2006 IEEE International Symposium on Semiconductor Manufacturing (01.09.2006)
Published in 2006 IEEE International Symposium on Semiconductor Manufacturing (01.09.2006)
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Development of a stacked WCSP package platform using TSV (Through Silicon Via) technology
Dunne, R., Takahashi, Y., Mawatari, K., Matsuura, M., Bonifield, T., Steinmann, P., Stepniak, D.
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
Effect of intermetallic formation on electromigration reliability of TSV-microbump joints in 3D interconnect
Yiwei Wang, Seung-Hyun Chae, Dunne, R., Takahashi, Y., Mawatari, K., Steinmann, P., Bonifield, T., Tengfei Jiang, Im, J., Ho, P. S.
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
Interconnect modeling for copper/low-k technologies
Nagaraj, N.S., Bonifield, T., Singh, A., Griesmer, R., Balsara, P.
Published in 17th International Conference on VLSI Design. Proceedings (2004)
Published in 17th International Conference on VLSI Design. Proceedings (2004)
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Conference Proceeding
Nickel SALICIDE Process Technology for CMOS Devices of 90nm Node and Beyond
Lu, J.P., Miles, D.S., DeLoach, J., Yue, D.F., Chen, P.J., Bonifield, T., Crank, S., Yu, S.F., Mehrad, F., Obeng, Y., Ramappa, D.A., Corum, D., Guldi, R.L., Robertson, L.S., Liu, X., Hall, L.H., Xu, Y.Q., Lin, B.Y., Griffin, A.F.Jr, Johnson, F.S., Grider, T., Mercer, D., Montgomery, C.
Published in 2006 International Workshop on Junction Technology (2006)
Published in 2006 International Workshop on Junction Technology (2006)
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An undergraduate interdisciplinary environmental assessment project in partnership with the U.S. Public Health Service
Jacoby, J., Moser, A.T., Bonifield, T., Botts, S., Daniels, P.D.
Published in Technology-Based Re-Engineering Engineering Education Proceedings of Frontiers in Education FIE'96 26th Annual Conference (1996)
Published in Technology-Based Re-Engineering Engineering Education Proceedings of Frontiers in Education FIE'96 26th Annual Conference (1996)
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Conference Proceeding
Production and decay of the Ou+ and 1u states of Kr2 excited by synchrotron radiation
Bonnifield, T.D, Rambow, F.H.K., Walters, G.K., McCusker, M.V., Lorents, D.C., Gutcheck, R.A.
Published in Chemical physics letters (01.01.1980)
Published in Chemical physics letters (01.01.1980)
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Journal Article
FSG process development for copper/damascene technology
Martin, J.S., Taylor, K.J., Luttmer, J.D., Ralston, A.K.R., West, J.A., Bonifield, T.D., Mickler, E.M., Bolnedi, S., Adams, C.T., Chew, K.-H., Bayman, A., van Schravendijk, B.
Published in Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461) (2001)
Published in Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461) (2001)
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