Crosstalk study of high speed on-package interconnects for multi-chip package
Bok Eng Cheah, Kong, Jackson, Khang Choong Yong, Lo, Louis, Po Yin Yaw
Published in 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01.08.2014)
Published in 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01.08.2014)
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Conference Proceeding
Study of conductor surface roughness impact on package insertion loss
Lo, H. Louis, Bok Eng Cheah
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
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Conference Proceeding
3D Interconnects - The enabler of next generation multi-Gbps single-ended bus
Khang Choong Yong, Bok Eng Cheah, Kong, Jackson
Published in 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference (01.09.2016)
Published in 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference (01.09.2016)
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Conference Proceeding
A novel trench routing for next-generation high-speed serial buses beyond 10Gbps applications
Kong, Jackson, Bok Eng Cheah, Khang Choong Yong, Heck, Howard, Lo, Louis
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
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Conference Proceeding
ELECTRICAL INTERCONNECT FOR ELECTRONIC PACKAGE
YONG KHANG CHOONG, KOOI CHI OOI, BEH TEONG KEAT, HOWARD L HECK, BOK ENG CHEAH, JACKSON CHUNG PENG KONG, STEPHEN H HALL
Year of Publication 30.05.2016
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Year of Publication 30.05.2016
Patent
Method to improve ball grid array Imax distribution for small form factor package design
Chin Lee Kuan, Huang, Jimmy, Bok Eng Cheah, Kong, Jackson
Published in 2015 6th Asia Symposium on Quality Electronic Design (ASQED) (01.08.2015)
Published in 2015 6th Asia Symposium on Quality Electronic Design (ASQED) (01.08.2015)
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Conference Proceeding
Study of dielectric material property impact on insertion loss for advanced packaging solutions
Bok Eng Cheah, Lo, H. Louis, Kong, Jackson
Published in 2015 IEEE International Conference on Consumer Electronics - Taiwan (01.06.2015)
Published in 2015 IEEE International Conference on Consumer Electronics - Taiwan (01.06.2015)
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Conference Proceeding
Segmented plated-thru-hole design in flip-chip packaging for improved electrical performance
Kong, Jackson, Bok Eng Cheah, Chin Lee Kuan, Ping Ping Ooi
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
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Conference Proceeding
Capacitive crosstalk compensation structure for improved high-speed on-package signaling
Bok Eng Cheah, Kong, Jackson, Ping Ping Ooi, Kok Hou Teh, Po Yin Yaw
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
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Conference Proceeding
Sensitivity study of channel termination on vertical side-chip interconnection
Kong, J., Bok Eng Cheah, Ai Heong Tan
Published in 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2012)
Published in 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2012)
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Conference Proceeding
A novel inter-package connection for advanced package-on-package enabling
Bok Eng Cheah, Kong, Jackson, Periaman, Shanggar, Kooi Chi Ooi
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Package technology evaluation and optimization for high-speed applications
Lo, Louis, Cheah, Bok Eng
Published in 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01.08.2014)
Published in 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01.08.2014)
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Conference Proceeding
Signal integrity study of high density through silicon via (TSV) technology
Bok Eng Cheah, Kong, Jackson, Chee Kit Chew, Kooi Chi Ooi, Periaman, Shanggar
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
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Conference Proceeding
Signaling analysis of inter-chip I/O package routing for Multi-Chip Package
Khang Choong Yong, Wil Choon Song, Bok Eng Cheah, Ain, M. F.
Published in 2012 4th Asia Symposium on Quality Electronic Design (ASQED) (01.07.2012)
Published in 2012 4th Asia Symposium on Quality Electronic Design (ASQED) (01.07.2012)
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Conference Proceeding
Full system power delivery analysis for single ended interface
Heng Chuan Shu, Bok Eng Cheah, Kong, Jackson, Sze Geat Pang, Li Chuang Quek
Published in Fifth Asia Symposium on Quality Electronic Design (ASQED 2013) (01.08.2013)
Published in Fifth Asia Symposium on Quality Electronic Design (ASQED 2013) (01.08.2013)
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Conference Proceeding
Intrinsic capacitance extraction and estimation for system-on-chip power delivery development
Li Chuang Quek, Bok Eng Cheah, Wai Ling Lee, Weng Chong Sam
Published in 2012 IEEE Asia Pacific Conference on Circuits and Systems (01.12.2012)
Published in 2012 IEEE Asia Pacific Conference on Circuits and Systems (01.12.2012)
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Conference Proceeding
Signal integrity and scalability study of a novel PoP inter-package system
Kong, J., Bok Eng Cheah, Periaman, S., Kooi Chi Ooi
Published in 2011 3rd Asia Symposium on Quality Electronic Design (ASQED) (01.07.2011)
Published in 2011 3rd Asia Symposium on Quality Electronic Design (ASQED) (01.07.2011)
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Conference Proceeding