Vertical power plane module for semiconductor packages
Cheah, Bok Eng, Kong, Jackson Chung Peng, Ooi, Kooi Chi, Lim, Seok Ling, Ong, Jenny Shio Yin
Year of Publication 24.05.2022
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Year of Publication 24.05.2022
Patent
Encapsulated vertical interconnects for high-speed applications and methods of assembling same
Cheah, Bok Eng, Kong, Jackson Chung Peng, Ooi, Kooi Chi, Poh, Yang Liang
Year of Publication 29.06.2021
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Year of Publication 29.06.2021
Patent
MULTI-LEVEL FAN-OUT INTERCONNECTS FOR INTEGRATED-CIRCUIT PACKAGES
Cheah, Bok Eng, Kong, Jackson Chung Peng, Lim, Seok Ling, Ong, Jenny Shio Yin
Year of Publication 17.06.2021
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Year of Publication 17.06.2021
Patent
LOW LOSS HIGH-SPEED INTERCONNECTS
Soon, Yean Ling, Cheah, Bok Eng, Ong, Ling Li, Lee, Kin Wai, Poh, Yang Liang
Year of Publication 17.06.2021
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Year of Publication 17.06.2021
Patent
Over-molded IC package with in-mold capacitor
Chang, Mooi Ling, Kong, Jackson Chung Peng, Cheah, Bok Eng, Lum, Wen Wei, Ooi, Ping Ping
Year of Publication 04.05.2021
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Year of Publication 04.05.2021
Patent
Integrated bridge for die-to-die interconnects
Cheah, Bok Eng, Kong, Jackson Chung Peng, Ooi, Kooi Chi, Lim, Seok Ling, Ong, Jenny Shio Yin
Year of Publication 22.03.2022
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Year of Publication 22.03.2022
Patent
Multi-conductor interconnect structure for a microelectronic device
Cheah, Bok Eng, Kong, Jackson Chung Peng, Ooi, Kooi Chi, Ooi, Ping Ping
Year of Publication 13.04.2021
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Year of Publication 13.04.2021
Patent
VERTICAL POWER PLANE MODULE FOR SEMICONDUCTOR PACKAGES
CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling, OOI, Kooi Chi
Year of Publication 03.03.2022
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Year of Publication 03.03.2022
Patent
EMBEDDED REFERENCE LAYERS FOR SEMICONDUCTOR PACKAGE SUBSTRATES
Cheah, Bok Eng, Kong, Jackson Chung Peng, Ooi, Kooi Chi, Lim, Seok Ling, Ong, Jenny Shio Yin
Year of Publication 03.03.2022
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Year of Publication 03.03.2022
Patent
ELECTRICAL SHIELD FOR STACKED HETEROGENEOUS DEVICE INTEGRATION
CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling, OOI, Kooi Chi
Year of Publication 03.03.2022
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Year of Publication 03.03.2022
Patent
MULTI-CHIP PACKAGE WITH EXTENDED FRAME
CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling, OOI, Kooi Chi
Year of Publication 03.03.2022
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Year of Publication 03.03.2022
Patent
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling, OOI, Kooi Chi
Year of Publication 03.03.2022
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Year of Publication 03.03.2022
Patent
3D high-inductive ground plane for crosstalk reduction
Parthasarathy, Ramaswamy, Kong, Jackson Chung Peng, Cheah, Bok Eng, Yong, Khang Choong
Year of Publication 06.04.2021
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Year of Publication 06.04.2021
Patent
Semiconductor package having an impedance-boosting channel
Yaw, Po Yin, Cheah, Bok Eng, Kong, Jackson Chung Peng, Yong, Khang Choong, Teh, Kok Hou
Year of Publication 06.04.2021
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Year of Publication 06.04.2021
Patent
RECESS BY-PASS INTERCONNECTS
Yap, Lee Fueng, Cheah, Bok Eng, Kong, Jackson Chung Peng, Ooi, Kooi Chi, Lee, Chan Kim
Year of Publication 01.04.2021
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Year of Publication 01.04.2021
Patent
MOLDED INTERCONNECTS IN BRIDGES FOR INTEGRATED-CIRCUIT PACKAGES
CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling
Year of Publication 01.04.2021
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Year of Publication 01.04.2021
Patent
Ring-in-ring configurable-capacitance stiffeners and methods of assembling same
Ong, Paik Wen, Kong, Jackson Chung Peng, Cheah, Bok Eng, Ooi, Kooi Chi
Year of Publication 16.03.2021
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Year of Publication 16.03.2021
Patent