Search Results - "Bok Eng Cheah" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

Semiconductor package with co-axial ball-grid-array

Semiconductor package with co-axial ball-grid-array

by Kong, Jackson Chung Peng, Cheah, Bok Eng, Lim, Seok Ling, Ong, Jenny Shio Yin
Year of Publication 22.03.2022

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Patent

COMPOSITE PRINTED CIRCUIT BOARDS AND DEVICES

COMPOSITE PRINTED CIRCUIT BOARDS AND DEVICES

by CHEAH, Bok Eng, ONG, Jenny Shio Yin, LOH, Chee Min, CHUAH, Tin Poay, LOO, Howe Yin, KONG, Jackson Chung Peng, LIM, Seok Ling, OOI, Kooi Chi
Year of Publication 04.01.2024

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Patent

3D STACKED DIE PACKAGE WITH MOLDED INTEGRATED HEAT SPREADER

3D STACKED DIE PACKAGE WITH MOLDED INTEGRATED HEAT SPREADER

by CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling
Year of Publication 10.03.2022

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Patent

MOLDED POWER DELIVERY INTERCONNECT MODULE FOR IMPROVED IMAX AND POWER INTEGRITY

MOLDED POWER DELIVERY INTERCONNECT MODULE FOR IMPROVED IMAX AND POWER INTEGRITY

by CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling
Year of Publication 10.03.2022

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Patent

STACKED SEMICONDUCTOR PACKAGE WITH FLYOVER BRIDGE

STACKED SEMICONDUCTOR PACKAGE WITH FLYOVER BRIDGE

by FOO, Loke Yip, CHEAH, Bok Eng, YEW, Teong Guan, CHEE, Choong Kooi, KONG, Jackson Chung Peng
Year of Publication 10.03.2022

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Patent

SEMICONDUCTOR PACKAGE WITH RING-IN-RING STIFFENERS AND METHODS OF ASSEMBLING SAME

SEMICONDUCTOR PACKAGE WITH RING-IN-RING STIFFENERS AND METHODS OF ASSEMBLING SAME

by CHEAH, Bok Eng, ONG, Paik Wen, KONG, Jackson Chung Peng, OOI, Kooi Chi
Year of Publication 09.03.2022

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Patent

MULTI-ORIENTATION DISPLAY DEVICE

MULTI-ORIENTATION DISPLAY DEVICE

by Loo, Howe Yin, Cheah, Bok Eng, Kong, Jackson Chung Peng, Browning, David W, Oh, Poh Tat, Lim, Min Suet, Yee, Chee Chun
Year of Publication 21.12.2023

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Patent

SEMICONDUCTOR PACKAGE WITH CO-AXIAL BALL-GRID-ARRAY

SEMICONDUCTOR PACKAGE WITH CO-AXIAL BALL-GRID-ARRAY

by CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling
Year of Publication 03.03.2022

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Patent

SEMICONDUCTOR SYSTEM AND METHOD OF FORMING SEMICONDUCTOR SYSTEM

SEMICONDUCTOR SYSTEM AND METHOD OF FORMING SEMICONDUCTOR SYSTEM

by CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling
Year of Publication 03.03.2022

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Patent

STACKED SEMICONDUCTOR PACKAGE WITH STEPPED STIFFENER

STACKED SEMICONDUCTOR PACKAGE WITH STEPPED STIFFENER

by CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling
Year of Publication 03.03.2022

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Patent

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

by CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling
Year of Publication 03.03.2022

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Patent

SEMICONDUCTOR PACKAGE WITH HYBRID THROUGH-SILICON-VIAS

SEMICONDUCTOR PACKAGE WITH HYBRID THROUGH-SILICON-VIAS

by CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling
Year of Publication 03.03.2022

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Patent

SUBSTRATE CORES FOR WARPAGE CONTROL

SUBSTRATE CORES FOR WARPAGE CONTROL

by CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling
Year of Publication 03.03.2022

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Patent

STACKED-COMPONENT PLACEMENT IN MULTIPLE-DAMASCENE PRINTED WIRING BOARDS FOR SEMICONDUCTOR PACKAGE SUBSTRATES

STACKED-COMPONENT PLACEMENT IN MULTIPLE-DAMASCENE PRINTED WIRING BOARDS FOR SEMICONDUCTOR PACKAGE SUBSTRATES

by Cheah, Bok Eng, Kong, Jackson Chung Peng, Kuan, Chin Lee
Year of Publication 23.04.2020

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Patent

MULTI-CHIP PACKAGE WITH RECESSED MEMORY

MULTI-CHIP PACKAGE WITH RECESSED MEMORY

by POH, Yang Liang, CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling
Year of Publication 22.12.2022

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Patent

Hybrid ball grid array package for high speed interconnects

Hybrid ball grid array package for high speed interconnects

by Cheah, Bok Eng, Kong, Jackson Chung Peng, Ooi, Kooi Chi, Lim, Seok Ling, Ong, Jenny Shio Yin
Year of Publication 13.12.2022

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Patent

Multi-chip package with extended frame

Multi-chip package with extended frame

by Cheah, Bok Eng, Kong, Jackson Chung Peng, Ooi, Kooi Chi, Lim, Seok Ling, Ong, Jenny Shio Yin
Year of Publication 13.12.2022

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Patent

Electrical shield for stacked heterogeneous device integration

Electrical shield for stacked heterogeneous device integration

by Cheah, Bok Eng, Kong, Jackson Chung Peng, Ooi, Kooi Chi, Lim, Seok Ling, Ong, Jenny Shio Yin
Year of Publication 13.12.2022

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Patent

Stiffener build-up layer package

Stiffener build-up layer package

by Cheah, Bok Eng, Kong, Jackson Chung Peng, Lim, Seok Ling, Ong, Jenny Shio Yin
Year of Publication 18.01.2022

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Patent

INTEGRATED BRIDGE FOR DIE-TO-DIE INTERCONNECTS

INTEGRATED BRIDGE FOR DIE-TO-DIE INTERCONNECTS

by Cheah, Bok Eng, Kong, Jackson Chung Peng, Ooi, Kooi Chi, Lim, Seok Ling, Ong, Jenny Shio Yin
Year of Publication 08.12.2022

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Patent

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