Semiconductor package with co-axial ball-grid-array
Kong, Jackson Chung Peng, Cheah, Bok Eng, Lim, Seok Ling, Ong, Jenny Shio Yin
Year of Publication 22.03.2022
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Year of Publication 22.03.2022
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COMPOSITE PRINTED CIRCUIT BOARDS AND DEVICES
CHEAH, Bok Eng, ONG, Jenny Shio Yin, LOH, Chee Min, CHUAH, Tin Poay, LOO, Howe Yin, KONG, Jackson Chung Peng, LIM, Seok Ling, OOI, Kooi Chi
Year of Publication 04.01.2024
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Year of Publication 04.01.2024
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3D STACKED DIE PACKAGE WITH MOLDED INTEGRATED HEAT SPREADER
CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling
Year of Publication 10.03.2022
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Year of Publication 10.03.2022
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MOLDED POWER DELIVERY INTERCONNECT MODULE FOR IMPROVED IMAX AND POWER INTEGRITY
CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling
Year of Publication 10.03.2022
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Year of Publication 10.03.2022
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STACKED SEMICONDUCTOR PACKAGE WITH FLYOVER BRIDGE
FOO, Loke Yip, CHEAH, Bok Eng, YEW, Teong Guan, CHEE, Choong Kooi, KONG, Jackson Chung Peng
Year of Publication 10.03.2022
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Year of Publication 10.03.2022
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SEMICONDUCTOR PACKAGE WITH RING-IN-RING STIFFENERS AND METHODS OF ASSEMBLING SAME
CHEAH, Bok Eng, ONG, Paik Wen, KONG, Jackson Chung Peng, OOI, Kooi Chi
Year of Publication 09.03.2022
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Year of Publication 09.03.2022
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MULTI-ORIENTATION DISPLAY DEVICE
Loo, Howe Yin, Cheah, Bok Eng, Kong, Jackson Chung Peng, Browning, David W, Oh, Poh Tat, Lim, Min Suet, Yee, Chee Chun
Year of Publication 21.12.2023
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Year of Publication 21.12.2023
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SEMICONDUCTOR PACKAGE WITH CO-AXIAL BALL-GRID-ARRAY
CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling
Year of Publication 03.03.2022
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Year of Publication 03.03.2022
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SEMICONDUCTOR SYSTEM AND METHOD OF FORMING SEMICONDUCTOR SYSTEM
CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling
Year of Publication 03.03.2022
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Year of Publication 03.03.2022
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STACKED SEMICONDUCTOR PACKAGE WITH STEPPED STIFFENER
CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling
Year of Publication 03.03.2022
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Year of Publication 03.03.2022
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SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling
Year of Publication 03.03.2022
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Year of Publication 03.03.2022
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SEMICONDUCTOR PACKAGE WITH HYBRID THROUGH-SILICON-VIAS
CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling
Year of Publication 03.03.2022
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Year of Publication 03.03.2022
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SUBSTRATE CORES FOR WARPAGE CONTROL
CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling
Year of Publication 03.03.2022
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Year of Publication 03.03.2022
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MULTI-CHIP PACKAGE WITH RECESSED MEMORY
POH, Yang Liang, CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling
Year of Publication 22.12.2022
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Year of Publication 22.12.2022
Patent
Hybrid ball grid array package for high speed interconnects
Cheah, Bok Eng, Kong, Jackson Chung Peng, Ooi, Kooi Chi, Lim, Seok Ling, Ong, Jenny Shio Yin
Year of Publication 13.12.2022
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Year of Publication 13.12.2022
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Multi-chip package with extended frame
Cheah, Bok Eng, Kong, Jackson Chung Peng, Ooi, Kooi Chi, Lim, Seok Ling, Ong, Jenny Shio Yin
Year of Publication 13.12.2022
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Year of Publication 13.12.2022
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Electrical shield for stacked heterogeneous device integration
Cheah, Bok Eng, Kong, Jackson Chung Peng, Ooi, Kooi Chi, Lim, Seok Ling, Ong, Jenny Shio Yin
Year of Publication 13.12.2022
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Year of Publication 13.12.2022
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Stiffener build-up layer package
Cheah, Bok Eng, Kong, Jackson Chung Peng, Lim, Seok Ling, Ong, Jenny Shio Yin
Year of Publication 18.01.2022
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Year of Publication 18.01.2022
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INTEGRATED BRIDGE FOR DIE-TO-DIE INTERCONNECTS
Cheah, Bok Eng, Kong, Jackson Chung Peng, Ooi, Kooi Chi, Lim, Seok Ling, Ong, Jenny Shio Yin
Year of Publication 08.12.2022
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Year of Publication 08.12.2022
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