Analysis and design of tightly coupled differential pairs with minimum conductor loss for high density and very high speed applications
Rotaru, Mihai Dragos, Kong, Jackson, Cheah, Bok Eng
Published in 2019 IEEE Asia-Pacific Microwave Conference (APMC) (01.12.2019)
Published in 2019 IEEE Asia-Pacific Microwave Conference (APMC) (01.12.2019)
Get full text
Conference Proceeding
Micro through-silicon via for transistor density scaling
Cheah, Bok Eng, Kong, Jackson Chung Peng, Chee, Choong Kooi, Lee, Wai Ling, Tan, Tat Hin
Year of Publication 08.10.2024
Get full text
Year of Publication 08.10.2024
Patent
Micro through-silicon via for transistor density scaling
Cheah, Bok Eng, Kong, Jackson Chung Peng, Chee, Choong Kooi, Lee, Wai Ling, Tan, Tat Hin
Year of Publication 03.09.2024
Get full text
Year of Publication 03.09.2024
Patent
Electronic device and crosstalk mitigating substrate
Chuah, Tin Poay, Cheah, Bok Eng, Kong, Jackson Chung Peng, Lim, Min Suet
Year of Publication 09.07.2024
Get full text
Year of Publication 09.07.2024
Patent
PACKAGE EDGE PASSIVE COMPONENT ARRAY FOR IMPROVED POWER INTEGRITY
CHEAH, Bok Eng, JAIN, Amit, KONG, Jackson Chung Peng, KUAN, Chin Lee, SHEKHAR, Sameer
Year of Publication 02.05.2024
Get full text
Year of Publication 02.05.2024
Patent
MICROELECTRONICS PACKAGE WITH A COMBINATION HEAT SPREADER/RADIO FREQUENCY SHIELD
CHEAH, Bok Eng, OOI, Ping Ping, KONG, Jackson Chung Peng, OOI, Kooi Chi
Year of Publication 29.04.2024
Get full text
Year of Publication 29.04.2024
Patent
OVER-MOLDED IC PACKAGE WITH IN-MOLD CAPACITOR
Bok Eng CHEAH, Wen Wei LUM, Ping Ping OOI, Mooi Ling CHANG, Jackson Chung Peng KONG
Year of Publication 24.04.2024
Get full text
Year of Publication 24.04.2024
Patent