Lie similarity analysis of MHD flow past a stretching surface embedded in porous medium along with imposed heat source/sink and variable viscosity
Agrawal, Priyanka, Dadheech, Praveen Kumar, Jat, R.N., Bohra, Mahesh, Nisar, Kottakkaran Sooppy, Khan, Ilyas
Published in Journal of materials research and technology (01.09.2020)
Published in Journal of materials research and technology (01.09.2020)
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Journal Article
Magneto Marangoni flow of γ−AL2O3 nanofluids with thermal radiation and heat source/sink effects over a stretching surface embedded in porous medium
Agrawal, Priyanka, Dadheech, Praveen Kumar, Jat, R.N., Nisar, Kottakkaran Sooppy, Bohra, Mahesh, Purohit, Sunil Dutt
Published in Case studies in thermal engineering (01.02.2021)
Published in Case studies in thermal engineering (01.02.2021)
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Journal Article
An efficient numerical approach for fractional multidimensional diffusion equations with exponential memory
Singh, Jagdev, Kumar, Devendra, Purohit, Sunil Dutt, Mishra, Aditya Mani, Bohra, Mahesh
Published in Numerical methods for partial differential equations (01.03.2021)
Published in Numerical methods for partial differential equations (01.03.2021)
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Journal Article
Magneto Marangoni flow of γ − A L 2 O 3 nanofluids with thermal radiation and heat source/sink effects over a stretching surface embedded in porous medium
Agrawal, Priyanka, Dadheech, Praveen Kumar, Jat, R.N., Nisar, Kottakkaran Sooppy, Bohra, Mahesh, Purohit, Sunil Dutt
Published in Case studies in thermal engineering (01.02.2021)
Published in Case studies in thermal engineering (01.02.2021)
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Journal Article
Analyses of Via-In-Pad Plated Over (VIPPO) and Dogbone in Fanout Routing High-Density Interconnects
Zhang, Yanyan, Tang, Junyan, Duan, Xiaomin, Datta, Srijan, Paladhi, Pavel R., Bohra, Mahesh, Chun, Sungjun, Dreps, Daniel M.
Published in 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (15.10.2023)
Published in 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (15.10.2023)
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Conference Proceeding
Analysis of Differential Stripline Routing Approaches within a PCB Via Field for Crosstalk Mitigation
Datta, Srijan, Wang, Yuechen, Tang, Junyan, Yang, Xianbo, Zhang, Yanyan, Paladhi, Pavel R., Bohra, Mahesh, Myers, Joshua C., Chun, Sungjun, Dreps, Daniel M.
Published in 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (15.10.2023)
Published in 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (15.10.2023)
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Conference Proceeding
NEXT Effect in Pin-area Routing at Receiver End from Via to Trace Coupling in a 32 Gb/s Channel
Paladhi, Pavel Roy, Zhang, Yanyan, Yang, Xianbo, Pham, Nam, Nguyen, Megan, Bohra, Mahesh, Tang, Junyan, Chun, Sungjun, Myers, Joshua, Becker, Wiren, Dreps, Daniel
Published in 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (09.10.2022)
Published in 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (09.10.2022)
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Conference Proceeding
Broadside-Coupled Differential Routing In Package Via Pin-Field Design
Zhang, Yanyan, Walls, Lloyd, Bohra, Mahesh, Tang, Junyan, Yang, Xianbo, Becker, Wiren D., Dreps, Daniel M.
Published in 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (17.10.2021)
Published in 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (17.10.2021)
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Conference Proceeding
Far End Crosstalk Mitigation of Differential High Speed Interconnects Within Printed Circuit Board Via Fields
Tang, Junyan, Yang, Xianbo, Hejase, Jose A., Bohra, Mahesh, Zhang, Yanyan, Duan, Xiaomin, Kaller, Dierk, Becker, Wiren D., Dreps, Daniel M.
Published in 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (17.10.2021)
Published in 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (17.10.2021)
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Conference Proceeding
Signal slope modulation method for high data transfer rates and reducing wiring density in high-speed digital systems
Bohra, Mahesh, Choi, Jinwoo, Zhang, Yanyan, Walls, Lloyd
Published in 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2017)
Published in 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2017)
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Conference Proceeding
Signal slope modulation method for high data transfer rates and reducing wiring density in high-speed digital systems
Bohra, Mahesh, Choi, Jinwoo, Zhang, Yanyan, Walls, Lloyd
Published in 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2017)
Published in 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2017)
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Conference Proceeding
REAL-TIME CONTROL OF VIA STUB DRILLING DEPTH ASYMMETRY
Roy Paladhi, Pavel, Walls, Lloyd Andre, Bohra, Mahesh, Becker, Wiren Dale, Zhang, Yanyan, Pham, Nam Huu, Dreps, Daniel Mark
Year of Publication 04.01.2024
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Year of Publication 04.01.2024
Patent
Signal Integrity Characterization of Channels With Asymmetric Via Stubs
Zhang, Yanyan, Bohra, Mahesh, Pham, Nam, Paladhi, Pavel R., Becker, Wiren D., Dreps, Daniel M.
Published in 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2020)
Published in 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2020)
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Conference Proceeding
An Approach For Tuning Signal Integrity Properties Of Edge Card Connectors With Conductive Fixture In High-Speed Link Channels
Zhang, Yanyan, Hejase, Jose A., Bohra, Mahesh, Paladhi, Pavel R., Shan, Lei, Chun, Sungjun, Audet, Jean J., Becker, Wiren D., Dreps, Daniel M.
Published in 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2019)
Published in 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2019)
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Conference Proceeding