Determination of the degree of ethylene vinyl acetate crosslinking via Soxhlet extraction: Gold standard or pitfall?
Hirschl, Ch, Neumaier, L., Puchberger, S., Mühleisen, W., Oreski, G., Eder, G.C., Frank, R., Tranitz, M., Schoppa, M., Wendt, M., Bogdanski, N., Plösch, A., Kraft, M.
Published in Solar energy materials and solar cells (01.12.2015)
Published in Solar energy materials and solar cells (01.12.2015)
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Journal Article
Impact of molecular weight of polymers and shear rate effects for nanoimprint lithography
Schulz, H., Wissen, M., Bogdanski, N., Scheer, H.-C., Mattes, K., Friedrich, Ch
Published in Microelectronic engineering (01.02.2006)
Published in Microelectronic engineering (01.02.2006)
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Journal Article
Imprintability of polymers for thermal nanoimprint
Scheer, H.-C., Bogdanski, N., Wissen, M., Möllenbeck, S.
Published in Microelectronic engineering (01.05.2008)
Published in Microelectronic engineering (01.05.2008)
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Journal Article
Conference Proceeding
Temperature-reduced nanoimprint lithography for thin and uniform residual layers
Bogdanski, N., Wissen, M., Ziegler, A., Scheer, H.-C.
Published in Microelectronic engineering (01.03.2005)
Published in Microelectronic engineering (01.03.2005)
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Journal Article
Conference Proceeding
Potential and limitations of a T-NIL/UVL hybrid process
Scheer, H.-C., Wissen, M., Bogdanski, N., Möllenbeck, S., Mayer, A.
Published in Microelectronic engineering (01.05.2010)
Published in Microelectronic engineering (01.05.2010)
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Journal Article
Conference Proceeding
Choice of the molecular weight of an imprint polymer for hot embossing lithography
Schulz, H., Wissen, M., Bogdanski, N., Scheer, H.-C., Mattes, K., Friedrich, Ch
Published in Microelectronic engineering (01.03.2005)
Published in Microelectronic engineering (01.03.2005)
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Journal Article
Conference Proceeding
Moulding of arrowhead structures
Möllenbeck, S., Bogdanski, N., Scheer, H.-C., Zajadacz, J., Zimmer, K.
Published in Microelectronic engineering (01.04.2009)
Published in Microelectronic engineering (01.04.2009)
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Journal Article
Conference Proceeding
172 nm pre-treatment for PDMS/PDMS replication
Möllenbeck, S., Bogdanski, N., Mayer, A., Scheer, H.-C., Zajadacz, J., Zimmer, K.
Published in Microelectronic engineering (01.05.2010)
Published in Microelectronic engineering (01.05.2010)
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Journal Article
Conference Proceeding
Profile evolution during thermal nanoimprint
Scheer, H.-C., Bogdanski, N., Wissen, M., Konishi, T., Hirai, Y.
Published in Microelectronic engineering (01.04.2006)
Published in Microelectronic engineering (01.04.2006)
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Journal Article
Conference Proceeding
Viscosity data from thermal imprint experiments
Scheer, H.-C., Bogdanski, N., Shibata, M., Möllenbeck, S.
Published in Microelectronic engineering (01.04.2009)
Published in Microelectronic engineering (01.04.2009)
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Journal Article
Conference Proceeding
3D-Hot embossing of undercut structures – an approach to micro-zippers
Bogdanski, N., Schulz, H., Wissen, M., Scheer, H.-C., Zajadacz, J., Zimmer, K.
Published in Microelectronic engineering (01.06.2004)
Published in Microelectronic engineering (01.06.2004)
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Journal Article
Conference Proceeding
Investigation of the separation of 3D-structures with undercuts
Möllenbeck, S., Bogdanski, N., Wissen, M., Scheer, H.-C., Zajadacz, J., Zimmer, K.
Published in Microelectronic engineering (01.05.2007)
Published in Microelectronic engineering (01.05.2007)
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Journal Article
Conference Proceeding
Issues and Requirements of Polymers for Thermal NIL
Scheer, H.-C., Wissen, M., Bogdanski, N., Möllenbeck, S.
Published in Journal of Photopolymer Science and Technology (01.01.2007)
Published in Journal of Photopolymer Science and Technology (01.01.2007)
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Journal Article
Analysis of the filling behaviour of trenches via air bubble tracking
Möllenbeck, S., Bogdanski, N., Wissen, M., Scheer, H.-C., Zajadacz, J., Zimmer, K.
Published in Microelectronic engineering (01.05.2008)
Published in Microelectronic engineering (01.05.2008)
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Journal Article
Conference Proceeding
Fingerprint stamp for evaluation of polymer flow time constants in thermal nanoimprint
Scheer, H.-C., Bogdanski, N., Möllenbeck, S., Wissen, M., Zimmer, K., Zajadacz, J.
Published in Microelectronic engineering (01.05.2007)
Published in Microelectronic engineering (01.05.2007)
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Journal Article
Conference Proceeding
UV curing of resists for warm embossing
WISSEN, M, SCHULZ, H, BOGDANSKI, N, SCHEER, H.-C, HIRAI, Y, KIKUTA, H, AHRENS, G, REUTHER, F, PFEIFFER, K
Published in Microelectronic engineering (01.06.2004)
Published in Microelectronic engineering (01.06.2004)
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Conference Proceeding
Journal Article
UV curing of resists for warm embossing
Wissen, M., Schulz, H., Bogdanski, N., Scheer, H.-C., Hirai, Y., Kikuta, H., Ahrens, G., Reuther, F., Pfeiffer, K.
Published in Microelectronic engineering (01.06.2004)
Published in Microelectronic engineering (01.06.2004)
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Journal Article
Implication of the light polarisation for UV curing of pre-patterned resists
Wissen, M., Bogdanski, N., Scheer, H.-C., Bitz, A., Ahrens, G., Gruetzner, G.
Published in Microelectronic engineering (01.03.2005)
Published in Microelectronic engineering (01.03.2005)
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Journal Article
Conference Proceeding
Issues in Nanoimprint Processes: the Imprint Pressure
Scheer, Hella-Christin, Bogdanski, Nicolas, Wissen, Matthias
Published in Japanese Journal of Applied Physics (01.07.2005)
Published in Japanese Journal of Applied Physics (01.07.2005)
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Journal Article