by Vincent, B., Boemmels, J., Ryckaert, J., Ervin, J.
Published in IEEE journal of the Electron Devices Society (2020)

by Ryckaert, J., Schuddinck, P., Weckx, P., Bouche, G., Vincent, B., Smith, J., Sherazi, Y., Mallik, A., Mertens, H., Demuynck, S., Bao, T. Huynh, Veloso, A., Horiguchi, N., Mocuta, A., Mocuta, D., Boemmels, J.
Published in 2018 IEEE Symposium on VLSI Technology (01.06.2018)

by Subramanian, S., Hosseini, M., Chiarella, T., Sarkar, S., Schuddinck, P., Chan, B. T., Radisic, D., Mannaert, G., Hikavyy, A., Rosseel, E., Sebaai, F., Peter, A., Hopf, T., Morin, P., Wang, S., Devriendt, K., Batuk, D., Martinez, G. T., Veloso, A., Litta, E. Dentoni, Baudot, S., Siew, Y. K., Zhou, X., Briggs, B., Capogreco, E., Hung, J., Koret, R., Spessot, A., Ryckaert, J., Demuynck, S., Horiguchi, N., Boemmels, J.
Published in 2020 IEEE Symposium on VLSI Technology (01.06.2020)

by Vega-Gonzalez, Victor, Radisic, D., Chan, Bt, Choudhury, S., Wang, S., Mingardi, A., Le, Q. Toan, Decoster, H., Oniki, Y., Puttarame, P., Vandersmissen, K., Soulie, J.-P., Peter, A., Batuk, A. Sepulveda. D., Martinez, G. T., Richard, O., Boemmels, J., Biesemans, S., Dentoni, E., Horiguchi, N., Park, S., Tokei, Z.
Published in 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (11.06.2023)

by Mertens, H., Hosseini, M., Chiarella, T., Zhou, D., Wang, S., Mannaert, G., Dupuy, E., Radisic, D., Tao, Z., Oniki, Y., Hikavyy, A., Rosseel, R., Mingardi, A., Choudhury, S., Gowda, P. Puttarame, Sebaai, F., Peter, A., Vandersmissen, K., Soulie, J.P., Keersgieter, A. De, Lima, L. Petersen Barbosa, Cavalcante, C., Batuk, D., Martinez, G.T., Geypen, J., Seidel, F., Paulussen, K., Favia, P., Boemmels, J., Loo, R., Wong, P., Marquez, A. Sepulveda, Chan, B.T., Mitard, J., Subramanian, S., Demuynck, S., Litta, E. Dentoni, Horiguchi, N., Samavedam, S., Biesemans, S.
Published in 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (11.06.2023)

by Vandooren, A., Wu, Z., Parihar, N., Franco, J., Parvais, B., Matagne, P., Debruyn, H., Mannaert, G., Devriendt, K., Teugels, L., Vecchio, E., Radisic, D., Rosseel, E., Hikavyy, A., Chan, B. T., Waldron, N., Mitard, J., Besnard, G., Alvarez, A., Gaudin, G., Schwarzenbach, W., Radu, I., Nguyen, B. Y., Huet, K., Tabata, T., Mazzamuto, F., Demuynck, S., Boemmels, J., Collaert, N., Horiguchi, N.
Published in 2020 IEEE Symposium on VLSI Technology (01.06.2020)

by Vincent, Benjamin, Ervin, J., Boemmels, J., Ryckaert, J.
Published in 2019 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) (14.10.2019)

by Tokei, Zs, Vega, V., Murdoch, G., O'Toole, M., Croes, K., Baert, R., Veen, M. Van der, Adelmann, C., Soulie, J. P., Boemmels, J., Wilson, C., Park, S. H., Sankaran, K., Pourtois, G., Sweerts, J., Paolillo, S., Decoster, S., Mao, M., Lazzarino, F., Versluijs, J., Blanco, V., Ercken, M., Kesters, E., Le, Q-T., Holsteyns, F., Heylen, N., Teugels, L., Devriendt, K., Struyf, H., Morin, P., Jourdan, N., Elshocht, S. Van, Ciofi, I., Gupta, A., Zahedmanesh, H., Vanstreels, K., Na, M. H.
Published in 2020 IEEE International Electron Devices Meeting (IEDM) (12.12.2020)

by Wu, C., Li, Y., Ciofi, I., Kauerauf, Th, Bömmels, J., De Wolf, I., Tőkei, Zs, Croes, K.
Published in Journal of applied physics (14.02.2015)

by Croes, K., Wu, C., Kocaay, D., Li, Y., Roussel, Ph, Bömmels, J., Tőkei, Zs
Published in ECS journal of solid state science and technology (01.01.2015)

by Zhang, L., de Marneffe, J.-F, Heylen, N., Murdoch, G., Tokei, Z., Boemmels, J., De Gendt, S., Baklanov, M. R.
Published in 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (01.05.2015)

by de Marneffe, J.-F, Zhang, L., Rutigliani, V., Noya, G., Cao, Y., Lesniewska, A., Pedreira, O., Croes, K., Gillot, C., Tokei, Z., Boemmels, J., Baklanov, M. R.
Published in 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (01.05.2015)

by Kim, M.-S., Harada, N., Kikuchi, Y., Boemmels, J., Mitard, J., Huynh-Bao, T., Matagne, P., Tao, Z., Li, W., Devriendt, K., Ragnarsson, L.-A., Lorant, C., Sebaai, F., Porret, C., Rosseel, E., Dangol, A., Batuk, D., Martinez-Alanis, G., Geypen, J., Jourdan, N., Sepulveda, A., Puliyalil, H., Jamieson, G., van der Veen, M., Teugels, L., El-Mekki, Z., Altamirano-Sanchez, E., Li, Y., Nakamura, H., Mocuta, D., Masuoka, F.
Published in 2019 Symposium on VLSI Technology (01.06.2019)

by Bao, T. Huynh, Yakimets, D., Ryckaert, J., Ciofi, I., Baert, R., Veloso, A., Boemmels, J., Collaert, N., Roussel, P., Demuynck, S., Raghavan, P., Mercha, A., Tokei, Z., Verkest, D., Thean, A. V-Y, Wambacq, P.
Published in 2014 44th European Solid State Device Research Conference (ESSDERC) (01.09.2014)

by Vandooren, A., Wu, Z., Khaled, A., Franco, J., Parvais, B., Li, W., Witters, L., Walke, A., Peng, L., Rassoul, N., Matagne, P., Debruyn, H., Jamieson, G., Inoue, F., Devriendt, K., Teugels, L., Heylen, N., Vecchio, E., Zheng, T., Radisic, D., Rosseel, E., Vanherle, W., Hikavyy, A., Chan, B. T., Besnard, G., Schwarzenbach, W., Gaudin, G., Radu, I., Nguyen, B.-Y., Waldron, N., De Heyn, V., Demuynck, S., Boemmels, J., Ryckaert, J., Collaert, N., Mocuta, D.
Published in 2019 Symposium on VLSI Technology (01.06.2019)

by Tang, B.J., Croes, K., Barbarin, Y., Wang, Y.Q., Degraeve, R., Li, Y., Toledano-Luque, M., Kauerauf, T., Bömmels, J., Tőkei, Zs, De Wolf, I.
Published in Microelectronics and reliability (01.09.2014)

by Matagne, P., Nakamura, H., Kim, M.-S., Kikuchi, Y., Huynh-Bao, T., Tao, Z., Li, W., Devriendt, K., Ragnarsson, L.-A., Boemmels, J., Mallik, A., Altamirano-Sachez, E., Sebaai, F., Lorant, C., Jourdan, N., Porret, C., Mocuta, D., Harada, N., Masuoka, F.
Published in 2018 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (01.09.2018)

by Clark, W. F., Juncker, A., Paladugu, E., Fried, D., Wilson, C. J., Pourtois, G., Gallagher, M., De Jamblinne, A., Piumi, D., Boemmels, J., Tokei, Z. S., Mocuta, D.
Published in 2016 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (01.09.2016)

by Weckx, P., Ryckaert, J., Putcha, V., De Keersgieter, A., Boemmels, J., Schuddinck, P., Jang, D., Yakimets, D., Bardon, M. G., Ragnarsson, L.-A, Raghavan, P., Kim, R. R., Spessot, A., Verkest, D., Mocuta, A.
Published in 2017 IEEE International Electron Devices Meeting (IEDM) (01.12.2017)

by Vandooren, A., Franco, J., Wu, Z., Parvais, B., Li, W., Witters, L., Walke, A., Peng, L., Deshpande, V., Rassoul, N., Hellings, G., Jamieson, G., Inoue, F., Devriendt, K., Teugels, L., Heylen, N., Vecchio, E., Zheng, T., Rosseel, E., Vanherle, W., Hikavyy, A., Mannaert, G., Chan, B. T., Ritzenthaler, R., Mitard, J., Ragnarsson, L., Waldron, N., De Heyn, V., Demuynck, S., Boemmels, J., Mocuta, D., Ryckaert, J., Collaert, N.
Published in 2018 IEEE International Electron Devices Meeting (IEDM) (01.12.2018)