Formation of straight-through pores in silicon substrates for 3-D metal interconnections
Lazarouk, S. K., Dolbik, A. V., Stepanova, L. I., Bodryh, T. I., Turtsevich, A. S., Shvedau, S. V., Labunov, V. A.
Published in 2012 22nd International Crimean Conference "Microwave & Telecommunication Technology" (01.09.2012)
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Published in 2012 22nd International Crimean Conference "Microwave & Telecommunication Technology" (01.09.2012)
Conference Proceeding