Producing high quality LTCC sensors for ITER in-vessel magnetic diagnostics
Adaikkan, Manikandan, Ma, Yunxing, Walach, Ulrich, Bochard, Marc, Bechtold, Franz, Vayakis, George, Walsh, Michael, Lino, Maria Paz Casas, Counsell, Glenn
Published in Fusion engineering and design (01.11.2022)
Published in Fusion engineering and design (01.11.2022)
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Journal Article
Vertical Integration of Passive Microwave Components Using Functional Via Structures in LTCC Multilayer Substrates
Yildiz, Omer F., Thomsen, Ole, Bochard, Marc, Yang, Cheng, Schuster, Christian
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2021)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2021)
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Journal Article
Introducing Functional Via Structures to Low Temperature Cofired Ceramics: How to Optimize Reliably and Efficiently
Yildiz, Omer F., Pathe, Nico, Bochard, Marc, Yang, Cheng, Schuster, Christian
Published in IEEE electromagnetic compatibility magazine (01.01.2021)
Published in IEEE electromagnetic compatibility magazine (01.01.2021)
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Journal Article
Magazine Article
Analysis of Differential Crosstalk and Transmission for Via Arrays in Low Temperature Cofired Ceramics
Yildiz, Omer F., Pathe, Nico, Bochard, Marc, Yang, Cheng, Schuster, Christian
Published in 2021 IEEE 25th Workshop on Signal and Power Integrity (SPI) (10.05.2021)
Published in 2021 IEEE 25th Workshop on Signal and Power Integrity (SPI) (10.05.2021)
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Conference Proceeding
Vertically Integrated Microwave-Filters Using Functional Via Structures in LTCC
Yildiz, Omer F., Thomsen, Ole, Bochard, Marc, Yang, Cheng, Schuster, Christian
Published in 2020 50th European Microwave Conference (EuMC) (12.01.2021)
Published in 2020 50th European Microwave Conference (EuMC) (12.01.2021)
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Conference Proceeding