Numerical Analysis of the Welding Behaviors in Micro-Copper Bumps
Hwang, Yeong-Maw, Pan, Cheng-Tang, Chen, Bo-Syun, Jian, Sheng-Rui
Published in Metals (Basel ) (01.03.2021)
Published in Metals (Basel ) (01.03.2021)
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Journal Article
Temperature effect on kinetic friction characteristics of Cu substrate composed by single crystal and polycrystalline structures
Chien, Chi-Hui, Wang, Chung-Ting, Tsai, Cing-Han, Yang, Ping-Feng, Lu, Ying-Xu, Chen, Bo-Syun
Published in Computational materials science (01.05.2016)
Published in Computational materials science (01.05.2016)
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Journal Article
Finite Element Analysis of Nanoindentation Responses in Bi2Se3 Thin Films
Cheng, Shu-Wei, Chen, Bo-Syun, Jian, Sheng-Rui, Hu, Yu-Min, Le, Phuoc Huu, Tuyen, Le Thi Cam, Lee, Jyh-Wei, Juang, Jenh-Yih
Published in Coatings (Basel) (01.10.2022)
Published in Coatings (Basel) (01.10.2022)
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Journal Article
Thermal characterization for dual side SiP module technology
Bo-Syun Chen, Tang-Yuan Chen, Jin-Feng Yang, Chin-Li-Kao, Yu-Chang Chen, Chan-Lin Yeh, Meng-Kai Shih
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
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Conference Proceeding
The warpage and thermal simulation study for embedded die technology
Tang-Yuan Chen, Bo-Syun Chen, Yang, Penny, Jin-Yuan Lai, MengKai Shih
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
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Conference Proceeding
Advanced design for optical devices' thermal fluid coupling dissipating
Chung-Ting Wang, Ping-Feng Yang, Chi-Hui Chien, Wei-Chi Lee, Ying-Xu Lu, Bo-Syun Chen, Yu-Yan Chen
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
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Conference Proceeding
Finite Element Analysis of Nanoindentation Responses in Bi[sub.2]Se[sub.3] Thin Films
Cheng, Shu-Wei, Chen, Bo-Syun, Jian, Sheng-Rui, Hu, Yu-Min, Le, Phuoc Huu, Tuyen, Le Thi Cam, Lee, Jyh-Wei, Juang, Jenh-Yih
Published in Coatings (Basel) (01.10.2022)
Published in Coatings (Basel) (01.10.2022)
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Journal Article
Effects of Stoichiometry on Structural, Morphological and Nanomechanical Properties of Bi2Se3 Thin Films Deposited on InP(111) Substrates by Pulsed Laser Deposition
Hwang, Yeong-Maw, Pan, Cheng-Tang, Chen, Bo-Syun, Le, Phuoc Huu, Uyen, Ngo Ngoc, Tuyen, Le Thi Cam, Nguyen, Vanthan, Luo, Chih-Wei, Juang, Jenh-Yih, Leu, Jihperng, Jian, Sheng-Rui
Published in Coatings (Basel) (05.10.2020)
Published in Coatings (Basel) (05.10.2020)
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Journal Article
Semiconductor package structure and method for manufacturing the same
Chen, Bo-Syun, Shih, Meng-Kai, Chen, Tang-Yuan, Yang, Jin-Feng, Kao, Chin-Li, Chen, Yu-Chang
Year of Publication 17.11.2020
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Year of Publication 17.11.2020
Patent
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
SHIH, Meng-Kai, KAO, Chin-Li, CHEN, Yu-Chang, YANG, Jin-Feng, CHEN, Bo-Syun, CHEN, Tang-Yuan
Year of Publication 19.09.2019
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Year of Publication 19.09.2019
Patent
Semiconductor package structure and method for manufacturing the same
Chen, Bo-Syun, Shih, Meng-Kai, Chen, Tang-Yuan, Yang, Jin-Feng, Kao, Chin-Li, Chen, Yu-Chang
Year of Publication 25.06.2019
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Year of Publication 25.06.2019
Patent
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
SHIH, Meng-Kai, KAO, Chin-Li, CHEN, Yu-Chang, YANG, Jin-Feng, CHEN, Bo-Syun, CHEN, Tang-Yuan
Year of Publication 07.03.2019
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Year of Publication 07.03.2019
Patent