Recrystallization as a nucleation mechanism for whiskers and hillocks on thermally cycled Sn-alloy solder films
Sarobol, P., Koppes, J.P., Chen, W.H., Su, P., Blendell, J.E., Handwerker, C.A.
Published in Materials letters (15.05.2013)
Published in Materials letters (15.05.2013)
Get full text
Journal Article
Interfacial and volumetric melting regimes of Sn nanoparticles
Robinson, L.D., Vikrant, K.S.N., Blendell, J.E., Handwerker, C.A., García, R.E.
Published in Acta materialia (15.08.2022)
Published in Acta materialia (15.08.2022)
Get full text
Journal Article
Ceramics: Grain Growth
Blendell, J.E., Handwerker, C.A.
Published in Encyclopedia of Materials: Science and Technology (2011)
Published in Encyclopedia of Materials: Science and Technology (2011)
Get full text
Book Chapter
Whiskers, hillocks, and film stress evolution in electroplated Sn and Sn-Cu films
Pedigo, A.E., Handwerker, C.A., Blendell, J.E.
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Get full text
Conference Proceeding
Effect of Sm2BaCuO5 on the properties of sintered (bulk) YBa2Cu3O6+x
HILL, M. D, BLENDELL, J. E, CHIANG, C. K, BENNETT, L. H, RITTER, J. J, CHACON, L, KELLY, J. F, WONG-NG, W
Published in Physica. C, Superconductivity (15.09.1995)
Published in Physica. C, Superconductivity (15.09.1995)
Get full text
Journal Article