Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging
Ivankovic, Andrej, Vanstreels, Kris, Vanderstraeten, Daniel, Brizar, Guy, Gillon, Renaud, Blansaer, Eddy, Vandevelde, Bart
Published in Microelectronics and reliability (01.11.2012)
Published in Microelectronics and reliability (01.11.2012)
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Journal Article
Impact of PCB-housing-interaction on QFN solder joint reliability
Vandevelde, Bart, Labie, Riet, Vanderstraeten, Daniel, Blansaer, Eddy
Published in 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.07.2020)
Published in 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.07.2020)
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Conference Proceeding
Improved QFN thermal cycling reliability using low melting temperature SnBi based solder paste LMPA-Q
Vandevelde, Bart, Labie, Riet, Lauwaert, Ralph, Werkhoven, Daniel, Vanderstraeten, Daniel, Blansaer, Eddy, Lannoo, Jonas, Pissoort, Davy
Published in 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.03.2019)
Published in 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.03.2019)
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Conference Proceeding
Development of fast and easy methods for measuring the Young's modulus of molding compounds for IC packages
Ivankovic, A, Vanstreels, K, Vanderstraeten, D, Brizar, G, Gillon, R, Blansaer, E, Vandevelde, B
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding
Encapsulating device and battery pack including such an encapsulating device
Blansaer, Eddy, Peter Dorren, Bastiaan, Den Bossche, Luc Jozef, Wojciechowski, Dominique
Year of Publication 29.01.2004
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Year of Publication 29.01.2004
Patent
Encapsulating device and battery pack including such a device
VAN DEN BOSSCHE, LUC JOZEF LOUISE, DORREN, BASTIAAN HENDRIK PETER, WOJCIECHOWSKI, DOMINIQUE, BLANSAER, EDDY
Year of Publication 01.10.2003
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Year of Publication 01.10.2003
Patent