A multi-step etch method for fabricating slightly tapered through-silicon vias based on modified Bosch process
Lin, Pengrong, Xie, Xiaochen, Wang, Yong, Lian, Binhao, Zhang, Guoqi
Published in Microsystem technologies : sensors, actuators, systems integration (09.07.2019)
Published in Microsystem technologies : sensors, actuators, systems integration (09.07.2019)
Get full text
Journal Article
The Mechanical Analysis of Sn-Base Bump
Yang, Jun, Yao, Quanbin, Lin, Pengrong, Lian, Binhao, Wang, Shengjie
Published in IOP conference series. Materials Science and Engineering (01.10.2019)
Published in IOP conference series. Materials Science and Engineering (01.10.2019)
Get full text
Journal Article
Effect of Cu on interfacial reaction in high-lead solder bumps
Liwei Xu, Mingliang Huang, Quanbin Yao, Yong Wang, Binhao Lian
Published in 2015 16th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2015)
Published in 2015 16th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2015)
Get full text
Conference Proceeding
Research on the impact of heat treatment on coating quality and reliability of welding after plating nickel
Dongmei Li, Jinchun He, Xiaocheng Feng, Binhao Lian, Yong Wang
Published in 2015 16th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2015)
Published in 2015 16th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2015)
Get full text
Conference Proceeding
The reliability of high-lead solder joints in flip-chip devices
Lingjuan Tian, Yuanfu Zhao, Quanbin Yao, Yusheng Cao, Binhao Lian
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Get full text
Conference Proceeding
The influence of the solder joint void on the CCGA package reliability
Yingzhuo Huang, Binhao Lian, Quanbin Yao, Xiaorui Lv, Pengrong Lin
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Get full text
Conference Proceeding
Simulation of bonding wire deformation in random vibration
Peifeng Hu, Yusheng Cao, Binhao Lian, Quanbin Yao
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
Get full text
Conference Proceeding
The study on grinding process of flip chip wafers
Xiaobo Zhuang, Binhao Lian, Jinchun He, Xiaocheng Feng
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
Get full text
Conference Proceeding
Research of surface wettability of plating on the ceramic shell
Dongmei Li, Xiaocheng Feng, Jinchun He, Binhao Lian, Yong Wang
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Get full text
Conference Proceeding
The effects of Au film thickness on the reliability of Sn-Pb solder joints
Xiaorui Lv, Pengrong Lin, Yingzhuo Huang, Xueming Jiang, Binhao Lian, Quanbin Yao
Published in 2015 16th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2015)
Published in 2015 16th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2015)
Get full text
Conference Proceeding
A kind of 3D hybrid assembly structure and technology
Dongmei Li, Xiaocheng Feng, Binhao Lian, Quanbin Yao
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
Get full text
Conference Proceeding
Reliability study of the solder joints in CCGA package during thermal test
Xiaorui Lv, Yingzhuo Huang, Pengrong Lin, Xueming Jiang, Binhao Lian, Quanbin Yao
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Get full text
Conference Proceeding
Effect of temperature cycling on reliability of flip chip solder joint
Xueming Jiang, Pengrong Lin, Yuezhong Song, Yingzhuo Huang, Binhao Lian, Quanbin Yao
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Get full text
Conference Proceeding
Research on the rework process of the ceramic ball grid array package
Yingzhuo Huang, Bo Huang, Pengrong Lin, Yusheng Cao, Binhao Lian, Quanbin Yao
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
Get full text
Conference Proceeding
Ceramic column grid array: A high-reliability approach for area array packaging
Yingzhuo Huang, Xueming Jiang, Pengrong Lin, Yusheng Cao, Binhao Lian, Quanbin Yao
Published in 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2012)
Published in 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2012)
Get full text
Conference Proceeding
The Study for Thermal Analysis Technology of Three-Dimension SRAM Component
Yusheng Cao, Tong Jiang, Jun Liu, Binhao Lian
Published in 2007 8th International Conference on Electronic Packaging Technology (01.08.2007)
Published in 2007 8th International Conference on Electronic Packaging Technology (01.08.2007)
Get full text
Conference Proceeding
Researchon Mechanical Behavior of Through silicon via of 2.5D Interposer
Yang, Jun, Yao, Quanbin, Lin, Pengrong, Xie, Xiaochen, Lian, Binhao
Published in 2018 19th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2018)
Published in 2018 19th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2018)
Get full text
Conference Proceeding
The finite element analysis on reliability of gold bump
Liu, Jiansong, Yao, Quanbin, Lin, Pengrong, Cao, Yusheng, Lian, Binhao
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2016)
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2016)
Get full text
Conference Proceeding
Study on the electrical performance of Au bump in FC ceramic package
Lu, Feng, Hu, Peifeng, Ding, Yajun, Cao, Yusheng, Lian, Binhao, Wang, Yong
Published in 2017 18th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2017)
Published in 2017 18th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2017)
Get full text
Conference Proceeding