The role of wood extractives in structural hardwood bonding and their influence on different adhesive systems
Bockel, S., Mayer, I., Konnerth, J., Harling, S., Niemz, P., Swaboda, C., Beyer, M., Bieri, N., Weiland, G., Pichelin, F.
Published in International journal of adhesion and adhesives (01.06.2019)
Published in International journal of adhesion and adhesives (01.06.2019)
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Journal Article
On the coalescence of gold nanoparticles
Arcidiacono, S, Bieri, N.R, Poulikakos, D, Grigoropoulos, C.P
Published in International journal of multiphase flow (01.07.2004)
Published in International journal of multiphase flow (01.07.2004)
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Journal Article
Influence of wood extractives on two-component polyurethane adhesive for structural hardwood bonding
Bockel, S, Mayer, I, Konnerth, J, Niemz, P, Swaboda, C, Beyer, M, Harling, S, Weiland, G, Bieri, N, Pichelin, F
Published in The Journal of adhesion (24.08.2018)
Published in The Journal of adhesion (24.08.2018)
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Journal Article
In-tandem deposition and sintering of printed gold nanoparticle inks induced by continuous Gaussian laser irradiation
CHUNG, J, BIERI, N. R, KO, S, GRIGOROPOULOS, C. P, POULIKAKOS, D
Published in Applied physics. A, Materials science & processing (01.09.2004)
Published in Applied physics. A, Materials science & processing (01.09.2004)
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Conference Proceeding
Journal Article
Radially Oscillating Flow Hybrid Cooling System for Low Profile Electronics Applications
Walchli, R., Linderman, R., Brunschwiler, T., Kloter, U., Rothuizen, H., Bieri, N., Poulikakos, D., Michel, B.
Published in 2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (01.03.2008)
Published in 2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (01.03.2008)
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Conference Proceeding