Correlation between the formation of particle defects on sputtered Cu seed layers and Cu targets
Bian, Yi-Jun, Cha, Ming-Yang, Chen, Lin, Sun, Qing-Qing, Zhang, Wei, Ding, Shi-Jin
Published in Micro & nano letters (04.09.2019)
Published in Micro & nano letters (04.09.2019)
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Journal Article
A Novel Approach for Electro Chemical Plating (ECP) Process Swirl Defect Reduction
Sun, Ri-Hui, Zhang, Ji-Wei, Jiang, Jian-Yong, Bian, Yi-Jun, Lin, Paul-Chang, Xing, Cheng, Li, Xiao, Zhou, Hua
Published in ECS transactions (06.03.2009)
Published in ECS transactions (06.03.2009)
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Journal Article
Investigation of Single-Transistor Active Pixel Image Sensor Compatible with Dual-Poly-Gate Technology
Xin-Yan Liu, Xi Lin, Cheng-Wei Cao, Qing-Qing Sun, Lin, Paul-Chang, Yi-Jun Bian, Cheng Xing, Peng-Fei Wang, Zhang, D. W.
Published in 2012 Symposium on Photonics and Optoelectronics (01.05.2012)
Published in 2012 Symposium on Photonics and Optoelectronics (01.05.2012)
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Conference Proceeding
Study of Crater Defect Reduction in Cu Plating Process
Chen, Liang, Wu, Kan, He, Peng, Bian, Yi J., Zhang, Jiwei, Lin, Paul-Chang, Chiu, Wen-Pin, Xing, Cheng
Published in ECS transactions (01.01.2010)
Published in ECS transactions (01.01.2010)
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Journal Article
The effectiveness of the TAX 327 nomogram in predicting overall survival in Chinese patients with metastatic castration-resistant prostate cancer
Bian, Xiao-Jie, Zhu, Yao, Shen, Yi-Jun, Wang, Jin-You, Ma, Chun-Guang, Zhang, Hai-Liang, Dai, Bo, Zhang, Shi-Lin, Yao, Xu-Dong, Ye, Ding-Wei
Published in Asian journal of andrology (01.09.2013)
Published in Asian journal of andrology (01.09.2013)
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Journal Article