Investigations on current filamentation in PIN diodes using TLP measurements and TCAD simulations
Scharf, Patrick, Sohrmann, Christoph, Holland, Steffen, Beyer, Volkhard
Published in ESSDERC 2019 - 49th European Solid-State Device Research Conference (ESSDERC) (01.09.2019)
Published in ESSDERC 2019 - 49th European Solid-State Device Research Conference (ESSDERC) (01.09.2019)
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Conference Proceeding
Introduction of zirconium oxide in a hardmask concept for highly selective patterning of scaled high aspect ratio trenches in silicon
Paul, Jan, Riedel, Stefan, Rudolph, Matthias, Wege, Stephan, Czernohorsky, Malte, Sundqvist, Jonas, Hohle, Christoph, Beyer, Volkhard
Published in Thin solid films (01.05.2012)
Published in Thin solid films (01.05.2012)
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Journal Article
Conference Proceeding
Optimized electrode and interface for enhanced reliability of high-k based metal-insulator-metal capacitors: Insulating Films on Semiconductors 2013
KOCH, Johannes, SEIDEL, Konrad, WEINREICH, Wenke, RIEDEL, Stefan, CHIANG, Jung-Chin, BEYER, Volkhard
Published in Microelectronic engineering (2013)
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Published in Microelectronic engineering (2013)
Journal Article
First-principles study of oxygen and aluminum defects in β-Si3N4: Compensation and charge trapping
Grillo, Maria Elena, Elliott, Simon D., Rodríguez, Jesús, Añez, Rafael, Coll, David Santiago, Suhane, Amit, Breuil, Leurent, Arreghini, Antonio, Degraeve, Robin, Shariq, Ahmed, Beyer, Volkhard, Czernohorsky, Malte
Published in Computational materials science (01.01.2014)
Published in Computational materials science (01.01.2014)
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Journal Article
Challenges in Design and Validation of MEMS Based Smart Sensor Systems
Mayer, Dirk, Lehmann, Martin, Beyer, Volkhard, Schneider, Andre, Schneider, Peter
Published in 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (02.06.2024)
Published in 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (02.06.2024)
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Conference Proceeding
A System Concept for Embedded Condition Monitoring of Electronic Sensor Modules
Langer, Tim, Beyer, Volkhard, Rolleke, Michael
Published in 2022 6th International Conference on System Reliability and Safety (ICSRS) (23.11.2022)
Published in 2022 6th International Conference on System Reliability and Safety (ICSRS) (23.11.2022)
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Conference Proceeding
High Resolution Patterning for Sub 30 nm Technology Nodes Using a Ceramic Based Dual Hard Mask
Paul, Jan, Rudolph, Matthias, Riedel, Stefan, Thrun, Xaver, Beyer, Volkhard, Wege, Stephan, Hohle, Christoph
Published in ECS transactions (01.04.2013)
Published in ECS transactions (01.04.2013)
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Journal Article
Extraction of Thermal Models for Electromigration Analysis at Advanced Nodes
Martin, Ron, Sohrmann, Christoph, Beyer, Volkhard, Vadakkekoithuruthil, Aravind, Debnath, Avi, Mau, Hendrik
Published in 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (28.09.2022)
Published in 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (28.09.2022)
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Conference Proceeding
Formation of an interface layer between Al 1‐x Si x O y thin films and the Si substrate during rapid thermal annealing
Michałowski, Paweł Piotr, Beyer, Volkhard, Czernohorsky, Malte, Kücher, Peter, Teichert, Steffen, Jaschke, Gert, Möller, Wolfhard
Published in Physica status solidi. C (01.02.2010)
Published in Physica status solidi. C (01.02.2010)
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Journal Article
High-density capacitors for SiP and SoC applications based on three-dimensional integrated metal-isolator-metal structures
Weinreich, Wenke, Rudolph, Matthias, Koch, Johannes, Paul, Jan, Seidel, Konrad, Riedel, Stefan, Sundqvist, Jonas, Steidel, Katja, Gutsch, Manuela, Beyer, Volkhard, Hohle, Christoph
Published in Proceedings of 2013 International Conference on IC Design & Technology (ICICDT) (01.05.2013)
Published in Proceedings of 2013 International Conference on IC Design & Technology (ICICDT) (01.05.2013)
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Conference Proceeding
Formation of an interface layer between Al1-xSixOy thin films and the Si substrate during rapid thermal annealing
Michałowski, Paweł Piotr, Beyer, Volkhard, Czernohorsky, Malte, Kücher, Peter, Teichert, Steffen, Jaschke, Gert, Möller, Wolfhard
Published in Physica status solidi. C (01.02.2010)
Published in Physica status solidi. C (01.02.2010)
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Journal Article
Select Device Disturb Phenomenon in TANOS NAND Flash Memories
Melde, T., Beug, M.F., Bach, L., Tilke, A.T., Knoefler, R., Bewersdorff-Sarlette, U., Beyer, V., Czernohorsky, M., Paul, J., Mikolajick, T.
Published in IEEE electron device letters (01.05.2009)
Published in IEEE electron device letters (01.05.2009)
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Journal Article
Advanced Dual Hard Mask Patterning Scheme to Enable High Resolution Lithography for sub 30 nm Technology Nodes
Paul, Jan, Rudolph, Matthias, Riedel, Stefan, Wege, Stephan, Hohle, Christoph, Beyer, Volkhard
Published in Meeting abstracts (Electrochemical Society) (04.06.2012)
Published in Meeting abstracts (Electrochemical Society) (04.06.2012)
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Journal Article
Scaling and optimization of high-density integrated Si-capacitors
Weinreich, Wenke, Seidel, Konrad, Rudolph, Matthias, Koch, Johannes, Paul, Jan, Riedel, Stefan, Sundqvist, Jonas, Steidel, Katja, Gutsch, Manuela, Beyer, Volkhard, Hohle, Christoph
Published in 2013 International Semiconductor Conference Dresden - Grenoble (ISCDG) (01.09.2013)
Published in 2013 International Semiconductor Conference Dresden - Grenoble (ISCDG) (01.09.2013)
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Conference Proceeding