Challenges in the implementation of low-k dielectrics in the back-end of line
Hoofman, R.J.O.M., Verheijden, G.J.A.M., Michelon, J., Iacopi, F., Travaly, Y., Baklanov, M.R., Tökei, Zs, Beyer, G.P.
Published in Microelectronic engineering (01.06.2005)
Published in Microelectronic engineering (01.06.2005)
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Investigation of MRI Artifact Caused by an In Vivo Dosimeter (DVS® )
Scarantino, C.W, Beyer, G.P, Coates, G.G, Rini, C
Published in International journal of radiation oncology, biology, physics (01.11.2007)
Published in International journal of radiation oncology, biology, physics (01.11.2007)
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An Implantable MOSFET Dosimeter for the Measurement of Radiation Dose in Tissue During Cancer Therapy
Beyer, G.P., Mann, G.G., Pursley, J.A., Espenhahn, E.T., Fraisse, C., Godfrey, D.J., Oldham, M., Carrea, T.B., Bolick, N., Scarantino, C.W.
Published in IEEE sensors journal (01.01.2008)
Published in IEEE sensors journal (01.01.2008)
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Electron spin resonance study of defects in low- κ oxide insulators ( κ = 2.5–2.0)
Afanas’ev, V.V., Keunen, K., Stesmans, A., Jivanescu, M., Tőkei, Zs, Baklanov, M.R., Beyer, G.P.
Published in Microelectronic engineering (01.07.2011)
Published in Microelectronic engineering (01.07.2011)
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Evaluating k-values for low -k materials after damascene integration: Method and results
Vereecke, B., Pantouvaki, M., Ciofi, I., Beyer, G.P., Tökei, Zs
Published in Microelectronic engineering (01.05.2011)
Published in Microelectronic engineering (01.05.2011)
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188
Scarantino, C., Prestidge, B., Anscher, M., Ferree, C., Black, R., Beyer, G.P.
Published in International journal of radiation oncology, biology, physics (01.11.2006)
Published in International journal of radiation oncology, biology, physics (01.11.2006)
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Barrier and seed repair performance of thin RuTa films for Cu interconnects
Volders, H., Carbonell, L., Heylen, N., Kellens, K., Zhao, C., Marrant, K., Faelens, G., Conard, T., Parmentier, B., Steenbergen, J., Peer, M. Van de, Wilson, C.J., Sleeckx, E., Beyer, G.P., Tőkei, Zs, Gravey, V., Shah, K., Cockburn, A.
Published in Microelectronic engineering (01.05.2011)
Published in Microelectronic engineering (01.05.2011)
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188: True in-Vivo Dosimetry in Breast and Prostate Cancer Patients: Variance Between Predicted and Measured Dose
Scarantino, C., Prestidge, B., Anscher, M., Ferree, C., Black, R., Beyer, G.P.
Published in International journal of radiation oncology, biology, physics (2006)
Published in International journal of radiation oncology, biology, physics (2006)
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A novel approach to resistivity and interconnect modeling
Travaly, Y., Bamal, M., Carbonell, L., Iacopi, F., Stucchi, M., Van Hove, M., Beyer, G.P.
Published in Microelectronic engineering (01.11.2006)
Published in Microelectronic engineering (01.11.2006)
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Time and temperature dependence of early stage Stress-Induced-Voiding in Cu/low-k interconnects
Croes, K., Wilson, C.J., Lofrano, M., Travaly, Y., De Roest, D., Tokei, Z., Beyer, G.P.
Published in 2009 IEEE International Reliability Physics Symposium (01.04.2009)
Published in 2009 IEEE International Reliability Physics Symposium (01.04.2009)
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Study of void formation kinetics in Cu interconnects using local sense structures
Croes, K, Lofrano, M, Wilson, C J, Carbonell, L, Siew, Y K, Beyer, G P, Tokei, Z
Published in 2011 International Reliability Physics Symposium (01.04.2011)
Published in 2011 International Reliability Physics Symposium (01.04.2011)
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Demonstration of a Sub-micron Damascene Cu/Low-k Mechanical Sensor to Monitor Stress in BEOL Metallization
Wilson, C.J., Croes, K., Tokei, Z., Beyer, G.P., Horsfall, A.B., O'Neill, A.G.
Published in 2009 IEEE International Conference on Microelectronic Test Structures (01.03.2009)
Published in 2009 IEEE International Conference on Microelectronic Test Structures (01.03.2009)
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Reliability challenges for copper low-k dielectrics and copper diffusion barriers
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The impact of scaling on interconnect reliability
Bruynseraede, C., Tokei, Z., Iacopi, F., Beyer, G.P., Michelon, J., Maex, K.
Published in 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual (2005)
Published in 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual (2005)
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Novel patterning shrink technique enabling sub-50 nm trench and contact integration
Demuynck, S., Tokei, Z., Zhao, C., de Marneffe, J., Struyf, H., Boullart, W., de Beeck, M.O., Carbonell, L., Heylen, N., Vaes, J., Beyer, G.P., Vanhaelemeersch, S., Sadjadi, R., Zhu, H., Cirigliano, P., Kim, J.S., Vertommen, J., Coenegrachts, B., Pavel, E., Athayde, A.
Published in 2007 International Symposium on Semiconductor Manufacturing (01.10.2007)
Published in 2007 International Symposium on Semiconductor Manufacturing (01.10.2007)
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Impact of the barrier/dielectric interface quality on reliability of Cu porous-low-k interconnects
Tokei, Z., Sutcliffe, V., Demuynck, S., Iacopi, F., Roussel, P., Beyer, G.P., Hoofman, R.J.O.M., Maex, K.
Published in 2004 IEEE International Reliability Physics Symposium. Proceedings (2004)
Published in 2004 IEEE International Reliability Physics Symposium. Proceedings (2004)
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