Challenges in the implementation of low-k dielectrics in the back-end of line
Hoofman, R.J.O.M., Verheijden, G.J.A.M., Michelon, J., Iacopi, F., Travaly, Y., Baklanov, M.R., Tökei, Zs, Beyer, G.P.
Published in Microelectronic engineering (01.06.2005)
Published in Microelectronic engineering (01.06.2005)
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Evaluating k-values for low -k materials after damascene integration: Method and results
Vereecke, B., Pantouvaki, M., Ciofi, I., Beyer, G.P., Tökei, Zs
Published in Microelectronic engineering (01.05.2011)
Published in Microelectronic engineering (01.05.2011)
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Barrier and seed repair performance of thin RuTa films for Cu interconnects
Volders, H., Carbonell, L., Heylen, N., Kellens, K., Zhao, C., Marrant, K., Faelens, G., Conard, T., Parmentier, B., Steenbergen, J., Peer, M. Van de, Wilson, C.J., Sleeckx, E., Beyer, G.P., Tőkei, Zs, Gravey, V., Shah, K., Cockburn, A.
Published in Microelectronic engineering (01.05.2011)
Published in Microelectronic engineering (01.05.2011)
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Growth mechanism and continuity of atomic layer deposited TiN films on thermal SiO2
Satta, A., Schuhmacher, J., Whelan, C. M., Vandervorst, W., Brongersma, S. H., Beyer, G. P., Maex, K., Vantomme, A., Viitanen, M. M., Brongersma, H. H., Besling, W. F. A.
Published in Journal of applied physics (15.12.2002)
Published in Journal of applied physics (15.12.2002)
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A NEMS-based sensor to monitor stress in deep sub-micron Cu/Low-k interconnects
Wilson, C J, Croes, K, Van Cauwenberghe, M, Tőkei, Zs, Beyer, G P, Horsfall, A B, O'Neill, A G
Published in Semiconductor science and technology (01.11.2009)
Published in Semiconductor science and technology (01.11.2009)
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A novel approach to resistivity and interconnect modeling
Travaly, Y., Bamal, M., Carbonell, L., Iacopi, F., Stucchi, M., Van Hove, M., Beyer, G.P.
Published in Microelectronic engineering (01.11.2006)
Published in Microelectronic engineering (01.11.2006)
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Electron spin resonance study of defects in low- κ oxide insulators ( κ = 2.5–2.0)
Afanas’ev, V.V., Keunen, K., Stesmans, A., Jivanescu, M., Tőkei, Zs, Baklanov, M.R., Beyer, G.P.
Published in Microelectronic engineering (01.07.2011)
Published in Microelectronic engineering (01.07.2011)
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Reliability challenges for copper low-k dielectrics and copper diffusion barriers
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Impact of the barrier/dielectric interface quality on reliability of Cu porous-low-k interconnects
Tokei, Z., Sutcliffe, V., Demuynck, S., Iacopi, F., Roussel, P., Beyer, G.P., Hoofman, R.J.O.M., Maex, K.
Published in 2004 IEEE International Reliability Physics Symposium. Proceedings (2004)
Published in 2004 IEEE International Reliability Physics Symposium. Proceedings (2004)
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Conference Proceeding
Comparison between intrinsic and integrated reliability properties of low-k materials
Croes, K, Pantouvaki, M, Carbonell, L, Zhao, L, Beyer, G P, Tokei, Z
Published in 2011 International Reliability Physics Symposium (01.04.2011)
Published in 2011 International Reliability Physics Symposium (01.04.2011)
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Conference Proceeding
The removal of copper oxides by ethyl alcohol monitored in situ by spectroscopic ellipsometry
SATTA, Alessandra, SHAMIRYAN, Denis, BAKLANOV, Mikhail R, WHELAN, Caroline M, QUOC TOAN LE, BEYER, Gerald P, VANTOMME, André, MAEX, Karen
Published in Journal of the Electrochemical Society (01.05.2003)
Published in Journal of the Electrochemical Society (01.05.2003)
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Electromigration and stress-induced-voiding in dual damascene Cu/low-k interconnects: a complex balance between vacancy and stress gradients
Croes, K, Wilson, C J, Lofrano, M, Vereecke, B, Beyer, G P, Tökei, Z
Published in 2010 IEEE International Reliability Physics Symposium (01.05.2010)
Published in 2010 IEEE International Reliability Physics Symposium (01.05.2010)
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Conference Proceeding
Study of void formation kinetics in Cu interconnects using local sense structures
Croes, K, Lofrano, M, Wilson, C J, Carbonell, L, Siew, Y K, Beyer, G P, Tokei, Z
Published in 2011 International Reliability Physics Symposium (01.04.2011)
Published in 2011 International Reliability Physics Symposium (01.04.2011)
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Conference Proceeding
Intrahepatic cholestasis of pregnancy
DULK, M. Den, VALENTIJN, R. M, WELTEN, C. A. H. C, BEYER, G. P. J
Published in Netherlands journal of medicine (01.10.2002)
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Published in Netherlands journal of medicine (01.10.2002)
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The impact of scaling on interconnect reliability
Bruynseraede, C., Tokei, Z., Iacopi, F., Beyer, G.P., Michelon, J., Maex, K.
Published in 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual (2005)
Published in 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual (2005)
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Conference Proceeding
Improved Methodology for Integrated k -Value Extractions
Ciofi, I., Borrello, G., Madia, O., Wilson, C. J., Vereecke, B., Beyer, G. P.
Published in IEEE transactions on electron devices (01.06.2012)
Published in IEEE transactions on electron devices (01.06.2012)
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Role of dielectric and barrier integrity in reliability of sub-100 nm copper low-k interconnects
Tokei, Z., Van Aelst, J., Waldfried, C., Escorcia, O., Roussel, P., Richard, O., Travaly, Y., Beyer, G.P., Maex, K.
Published in 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual (2005)
Published in 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual (2005)
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Conference Proceeding
Electrical characterization of CNT contacts with Cu Damascene top contact
van der Veen, Marleen H., Vereecke, Bart, Huyghebaert, Cedric, Cott, Daire J., Sugiura, Masahito, Kashiwagi, Yusaku, Teugels, Lieve, Caluwaerts, Rudy, Chiodarelli, Nicolò, Vereecken, Philippe M., Beyer, Gerald P., Heyns, Marc M., De Gendt, Stefan, Tökei, Zsolt
Published in Microelectronic engineering (01.06.2013)
Published in Microelectronic engineering (01.06.2013)
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