Soldered hot-via E-band and W-band power amplifier MMICs for millimeter-wave chip scale packaging
Bessemoulin, Alexandre, Rodriguez, Melissa C., Mahon, Simon J., Parker, Anthony E., Heimlich, Michael C.
Published in 2016 IEEE MTT-S International Microwave Symposium (IMS) (01.05.2016)
Published in 2016 IEEE MTT-S International Microwave Symposium (IMS) (01.05.2016)
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Conference Proceeding
A 4-W X-band compact coplanar high-power amplifier MMIC with 18-dB gain and 25% PAE
Bessemoulin, A., Quay, R., Ramberger, S., Massler, H., Schlechtweg, M.
Published in IEEE journal of solid-state circuits (01.09.2003)
Published in IEEE journal of solid-state circuits (01.09.2003)
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Journal Article
Broadband Active and Passive Balun Circuits: Functional Blocks for Modern Millimeter-Wave Radio Architectures
Costantini, A., Lawrence, B., Mahon, S., Harvey, J., McCulloch, G., Bessemoulin, A.
Published in 2006 European Microwave Integrated Circuits Conference (01.09.2006)
Published in 2006 European Microwave Integrated Circuits Conference (01.09.2006)
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Conference Proceeding