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Thermal conductance at Sn-0.5mass%Al solder alloy/substrate interface as a factor for tailoring cellular/dendritic growth
Oliveira, Ricardo, Cruz, Clarissa, Barros, André, Bertelli, Felipe, Spinelli, José Eduardo, Garcia, Amauri, Cheung, Noé
Published in Journal of thermal analysis and calorimetry (01.04.2022)
Published in Journal of thermal analysis and calorimetry (01.04.2022)
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An alternative thermal approach to evaluate the wettability of solder alloys
Santos, Washington L.R., Silva, Bismarck L., Bertelli, Felipe, Spinelli, José E., Cheung, Noé, Garcia, Amauri
Published in Applied thermal engineering (25.08.2016)
Published in Applied thermal engineering (25.08.2016)
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Metal/mold thermal conductance affecting ultrafine scale microstructures in aluminum eutectic alloys
Kakitani, Rafael, Oliveira, Ricardo, Reyes, Rodrigo V., Rodrigues, Adilson V., Bertelli, Felipe, Garcia, Amauri, Spinelli, José E., Cheung, Noé
Published in Case studies in thermal engineering (01.08.2021)
Published in Case studies in thermal engineering (01.08.2021)
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Microstructure, tensile properties and wear resistance correlations on directionally solidified Al-Sn-(Cu; Si) alloys
Bertelli, Felipe, Freitas, Emmanuelle S., Cheung, Noé, Arenas, Maria A., Conde, Ana, de Damborenea, Juan, Garcia, Amauri
Published in Journal of alloys and compounds (25.02.2017)
Published in Journal of alloys and compounds (25.02.2017)
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Nature inspired algorithms for the solution of inverse heat transfer problems applied to distinct unsteady heat flux orientations in cylindrical castings
da Silva-Santos, Carlos Henrique, Goulart, Pedro Roberto, Bertelli, Felipe, Garcia, Amauri, Cheung, Noé
Published in Journal of intelligent manufacturing (01.06.2023)
Published in Journal of intelligent manufacturing (01.06.2023)
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Progression of plastic strain on heavy-haul railway rail under random pure rolling and its influence on crack initiation
Reis, Thairon, Lima, Eduardo de Abreu, Bertelli, Felipe, dos Santos Junior, Auteliano Antunes
Published in Advances in engineering software (1992) (01.10.2018)
Published in Advances in engineering software (1992) (01.10.2018)
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Microstructural development of hypoeutectic Zn–(10–40)wt%Sn solder alloys and impacts of interphase spacing and macrosegregation pattern on hardness
Santos, Washington L.R., Brito, Crystopher, Bertelli, Felipe, Spinelli, José E., Garcia, Amauri
Published in Journal of alloys and compounds (25.10.2015)
Published in Journal of alloys and compounds (25.10.2015)
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Cellular growth of single-phase Zn–Ag alloys unidirectionally solidified
Dias, Marcelino, Brito, Crystopher, Bertelli, Felipe, Garcia, Amauri
Published in Materials chemistry and physics (14.02.2014)
Published in Materials chemistry and physics (14.02.2014)
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Characterization of Dendritic Microstructure, Intermetallic Phases, and Hardness of Directionally Solidified Al-Mg and Al-Mg-Si Alloys
Brito, Crystopher, Costa, Thiago A., Vida, Talita A., Bertelli, Felipe, Cheung, Noé, Spinelli, José Eduardo, Garcia, Amauri
Published in Metallurgical and materials transactions. A, Physical metallurgy and materials science (01.08.2015)
Published in Metallurgical and materials transactions. A, Physical metallurgy and materials science (01.08.2015)
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Cooling thermal parameters, microstructure, segregation and hardness in directionally solidified Al–Sn-(Si;Cu) alloys
Bertelli, Felipe, Brito, Crystopher, Ferreira, Ivaldo L., Reinhart, Guillaume, Nguyen-Thi, Henri, Mangelinck-Noël, Nathalie, Cheung, Noé, Garcia, Amauri
Published in Materials & Design (05.05.2015)
Published in Materials & Design (05.05.2015)
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Interfacial heat transfer and microstructural analyses of a Bi- 5% Sb lead-free alloy solidified against Cu, Ni and low-C steel substrates
Soares, Thiago, Cruz, Clarissa, Xavier, Marcella, Reyes, Rodrigo V., Bertelli, Felipe, Garcia, Amauri, Spinelli, José E., Cheung, Noé
Published in Journal of alloys and compounds (15.04.2021)
Published in Journal of alloys and compounds (15.04.2021)
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Temperature-Induced Chemical Changes in Lubricant Automotive Oils Evaluated Using Raman Spectroscopy
de M Bezerra, Andressa Cristina, de A Coelho, Nelize Maria, Bertelli, Felipe, Pacheco, Marcos Tadeu T, Silveira, Jr, Landulfo
Published in Applied spectroscopy (01.02.2021)
Published in Applied spectroscopy (01.02.2021)
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Solidification paths of Al-Cu-Sn alloys: Comparison of thermodynamic analyses and solidification experiments using in situ X-radiography
de Albuquerque, Sarah, Reinhart, Guillaume, Magalhães, Danielle Cristina Camilo, Spinelli, José Eduardo, Soltani, Hadjer, Boumechta, Wafa, Bertelli, Felipe, Nguyen-Thi, Henri
Published in Materials today communications (01.08.2024)
Published in Materials today communications (01.08.2024)
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The effect of the growth rate on microsegregation: Experimental investigation in hypoeutectic Al–Fe and Al–Cu alloys directionally solidified
Meza, Elisangela S., Bertelli, Felipe, Goulart, Pedro R., Cheung, Noé, Garcia, Amauri
Published in Journal of alloys and compounds (05.06.2013)
Published in Journal of alloys and compounds (05.06.2013)
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The application of an analytical model to solve an inverse heat conduction problem: Transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates
Curtulo, Joanisa P., Dias, Marcelino, Bertelli, Felipe, Silva, Bismarck L., Spinelli, José E., Garcia, Amauri, Cheung, Noé
Published in Journal of manufacturing processes (01.12.2019)
Published in Journal of manufacturing processes (01.12.2019)
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Interconnection of thermal parameters, microstructure, macrosegregation and microhardness of unidirectionally solidified Zn-rich Zn–Ag peritectic alloys
Dias, Marcelino, Brito, Crystopher, Bertelli, Felipe, Rocha, Otávio L., Garcia, Amauri
Published in Materials in engineering (01.11.2014)
Published in Materials in engineering (01.11.2014)
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The effect of the growth rate on microsegregation: Experimental investigation in hypoeutectic AlaFe and AlaCu alloys directionally solidified
Meza, Elisangela, Bertelli, Felipe, Goulart, Pedro, Cheung, Noe, Garcia, Amauri
Published in Journal of alloys and compounds (01.06.2013)
Published in Journal of alloys and compounds (01.06.2013)
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