20 GHz Antenna Radiation Pattern Obtained From Near-Field Mapping With Electrooptic Probe on a Single Plane
Gaborit, Gwenael, Artillan, Philippe, Bermond, Cedric, Revillod, Guillaume, Chevrier-Gros, Guillaume, Duvillaret, Lionel
Published in IEEE antennas and wireless propagation letters (01.07.2020)
Published in IEEE antennas and wireless propagation letters (01.07.2020)
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Journal Article
Design of a High-Speed Ethernet Connector for Harsh Environments
Boujmad, Younes, Bermond, Cedric, Artillan, Philippe, Gavard, Olivier, Prudhom, Marie, Khalili, Farsin, Husson-Charlet, Edith, Barbosa, Jean-Paul, Flechet, Bernard
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2020)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2020)
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Journal Article
Modeling and Frequency Performance Analysis of Through Silicon Capacitors in Silicon Interposers
Khadim Dieng, Artillan, Philippe, Bermond, Cedric, Guiller, Olivier, Lacrevaz, Thierry, Joblot, Sylvain, Houzet, Gregory, Farcy, Alexis, Perrier, Anne-Laure, Lamy, Yann, Flechet, Bernard
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2017)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2017)
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Journal Article
Electrical Broadband Characterization Method of Dielectric Molding in 3-D IC and Results
Lacrevaz, Thierry, Bermond, Cedric, Bouayadi, Ossama El, Houzet, Gregory, Artillan, Philippe, Lamy, Yann, Dieng, Khadim, Flechet, Bernard
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2014)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2014)
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Journal Article
Characterization in a Wide Frequency Range (40 MHz-67 GHz) of a KTa0.65Nb0.35O3 Thin Film for Tunable Applications
Houzet, Grégory, Lacrevaz, Thierry, Bermond, Cédric, Fléchet, Bernard, Le Febvrier, Arnaud, Députier, Stéphanie, Guilloux-Viry, Maryline, Queffelec, Patrick
Published in Integrated ferroelectrics (22.11.2014)
Published in Integrated ferroelectrics (22.11.2014)
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Journal Article
Characterization in a Wide Frequency Range (40 MHz–67 GHz) of a KTa 0.65 Nb 0.35 O 3 Thin Film for Tunable Applications
Houzet, Grégory, Lacrevaz, Thierry, Bermond, Cédric, Fléchet, Bernard, Le Febvrier, Arnaud, Députier, Stéphanie, Guilloux-Viry, Maryline, Queffelec, Patrick
Published in Integrated ferroelectrics (22.11.2014)
Published in Integrated ferroelectrics (22.11.2014)
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Journal Article
RF characterization of the substrate coupling noise between TSV and active devices in 3D integrated circuits
Bermond, C., Brocard, M., Lacrevaz, T., Farcy, A., Le Maître, P., Leduc, P., Ben Jamaa, H., Chéramy, S., Sillon, N., Fléchet, B.
Published in Microelectronic engineering (25.11.2014)
Published in Microelectronic engineering (25.11.2014)
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Journal Article
Frequency Effect on Voltage Linearity of [Formula Omitted]-Based RF Metal-Insulator-Metal Capacitors
Bertaud, Thomas, Blonkowski, Serge, Bermond, CÉdric, Vallee, Christophe, Gonon, Patrice, Gros-Jean, MichaËl, Flechet, Bernard
Published in IEEE electron device letters (01.02.2010)
Published in IEEE electron device letters (01.02.2010)
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Journal Article
Characterization in a Wide Frequency Range (40 MHz-67 GHz) of a KTa^sub 0.65^Nb^sub 0.35^O^sub 3^ Thin Film for Tunable Applications
Houzet, Grégory, Lacrevaz, Thierry, Bermond, Cédric, Fléchet, Bernard, Le Febvrier, Arnaud, Députier, Stéphanie, Guilloux-Viry, Maryline, Queffelec, Patrick
Published in Integrated ferroelectrics (01.01.2014)
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Published in Integrated ferroelectrics (01.01.2014)
Journal Article
Fast and robust RF characterization method of insulators used in high speed interconnects networks
Lacrevaz, Thierry, Houzet, Gregory, Auchere, David, Artillan, Philippe, Bermond, Cedric, Blampey, Benjamin, Flechet, Bernard
Published in 2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI) (01.05.2018)
Published in 2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI) (01.05.2018)
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Conference Proceeding
Optimization of a Miniaturized Ethernet 10 Gbits/s 8 Conductors Interconnect for Harsh Environments
BOUJMAD, Younes, ARTILLAN, Philippe, BERMOND, Cedric, GAVARD, Olivier, PRUDHOM, Marie, KHALILI, Farsin, HUSSON-CHARLET, Edith, BARBOSA, Jean-Paul, FLECHET, Bernard
Published in 2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI) (01.06.2019)
Published in 2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI) (01.06.2019)
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Conference Proceeding
Wide-band simulations of differential 3D interconnect propagation performances in a photonic interposer
Morot, Kevin, Jacquinot, Helene, Lacrevaz, Thierry, Bermond, Cedric, Farcy, Alexis, Flechet, Bernard
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
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Conference Proceeding
Electrical Model of Different Architectures of through Silicon Capacitors for High Frequency Power Distribution Network (PDN) Decoupling Operations
Dieng, Khadim, Bermond, Cédric, Artillan, Philippe, Lacrevaz, Thierry, Houzet, Grégory, Fléchet, Bernard, Guiller, Olivier, Joblot, Sylvain, Farcy, Alexis, Lamy, Yann
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
3D interconnect optimization for single channel 100-GBps transmission in a photonic interposer
Morot, Kevin, Farcy, Alexis, Lacrevaz, Thierry, Bermond, Cedric, Artillan, Philippe, Flechet, Bernard, Jacquinot, Helene, Scheiblin, Pascal
Published in 2017 IEEE 21st Workshop on Signal and Power Integrity (SPI) (01.05.2017)
Published in 2017 IEEE 21st Workshop on Signal and Power Integrity (SPI) (01.05.2017)
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Conference Proceeding
Electrical Characterization of Advanced MIM Capacitors With Insulator for High-Density Packaging and RF Applications
Bertaud, T., Bermond, C., Blonkowski, S., Vallee, C., Lacrevaz, T., Farcy, A., Gros-Jean, M., Flechet, B.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2012)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2012)
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Journal Article