by Shabgard, H., Bergman, T.L., Sharifi, N., Faghri, A.
Published in International journal of heat and mass transfer (01.07.2010)

by AHMED, I, BERGMAN, T. L
Published in Journal of thermal spray technology (01.06.2000)

by Bergman, T.L.
Published in International journal of heat and mass transfer (01.02.2009)

by Stark, J.R., Prasad, R., Bergman, T.L.
Published in International journal of heat and mass transfer (01.08.2017)

by Bergman, T.L., Hyun, M.T.
Published in International journal of heat and mass transfer (1996)

by Manickam, S.S., Shah, R., Tomei, J., Bergman, T.L., Chaudhuri, B.
Published in Powder technology (12.07.2010)

by Paul, T.H., Bergman, T.L.
Published in Experimental thermal and fluid science (1995)

by Bergman, T.L., Faghri, A., Viskanta, R.
Published in International journal of heat and mass transfer (01.09.2008)

by AHMED, I, BERGMAN, T. L
Published in Journal of thermal spray technology (01.06.1999)

by Bergman, T.L., Srinivasan, R.
Published in International journal of heat and mass transfer (1989)

by Bergman, T.L., Son, Y.S.
Published in International journal of heat and mass transfer (01.09.1995)

by Moh, J. H., Bergman, T. L., Kuo, D.C.
Published in Numerical heat transfer. Part A, Applications (01.01.1997)

by Liu, A., Voth, T.E., Bergman, T.L.
Published in International journal of heat and mass transfer (1993)

by Bergman, T.L., Webb, B.W.
Published in International journal of heat and mass transfer (1990)

by Bergman, T.L., Incropera, F.P., Viskanta, R.
Published in International journal of heat and mass transfer (01.01.1985)

by Petri, J.G., Bergman, T.L.
Published in International journal of heat and mass transfer (1990)

by Karwe, M.V, Bergman, T.L, Paolucci, S
Published in HTD (USA) (1993)

by Bergman, T.L., Incropera, F.P., Viskanta, R.
Published in International journal of heat and mass transfer (1982)

by Bergman, T.L., Incropera, F.P., Viskanta, R.
Published in International journal of heat and mass transfer (01.01.1985)

by Mittal, S., Masada, G.Y., Bergman, T.L.
Published in IEEE transactions on components, packaging, and manufacturing technology. Part A (01.03.1996)