Qualification of bumping processes: Experimental and numerical investigations on mechanical stress and failure modes induced by shear test
Gallois-Garreignot, Sébastien, Benzima, Naceur, Benmussa, Etienne, Moutin, Caroline, Bouchard, Pierre-Olivier, Fiori, Vincent, Tavernier, Clément
Published in Microelectronics and reliability (01.05.2015)
Published in Microelectronics and reliability (01.05.2015)
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