Next Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications
Chen, Qianwen, Belyansky, Michael, Sulehria, Yasir, Horibe, Akihiro, Qin, Liqiao, Pujari, Ruturaj, Perfecto, Eric, Lie, Fee Li, Butt, Shahid, Polomoff, Nick, Miyazawa, Risa, Kohara, Sayuri, Farooq, Mukta, Hisada, Takashi, Oakley, Jennifer, Skordas, Spyridon, Fan, Susan, Sakuma, Katsuyuki, Knickerbocker, John, Mcherron, Dale, Tamura, Takeshi, Ishii, Takayuki, Jaipan, Panupong, Nishimura, Satoshi, Son, Ilseok, Maeda, Yohei, Koga, Takashi, Klein, Joseph, Tashiro, Kei, Arkalgud, Sitaram, Kondo, Yoshihiro
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
A new technique for evaluating stacked nanosheet inner spacer TDDB reliability
Shen, Tian, Watanabe, Koji, Zhou, Huimei, Belyansky, Michael, Stuckert, Erin, Zhang, Jingyun, Greene, Andrew, Basker, Veeraraghavan, Wang, Miaomiao
Published in 2020 IEEE International Reliability Physics Symposium (IRPS) (01.04.2020)
Published in 2020 IEEE International Reliability Physics Symposium (IRPS) (01.04.2020)
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Conference Proceeding
Highly Selective SiGe Dry Etch Process for the Enablement of Stacked Nanosheet Gate-All-Around Transistors
Durfee, Curtis, Kal, Subhadeep, Pancharatnam, Shanti, Bhuiyan, Maruf, Otto IV, Ivo, Flaugh, Matthew, Smith, Jeffrey, Chanemougame, Daniel, Alix, Cheryl, Zhou, Huimei, Frougier, Julien, Greene, Andrew, Belyansky, Michael, Watanabe, Koji, Zhang, Jingyun, Schmidt, Daniel, Breton, Mary, Zhao, Kai, Wang, Miaomiao, Basker, Veeraraghavan, Mosden, Aelan, Loubet, Nicolas, Guo, Dechao, Biolsi, Peter, Haran, Bala, Bu, Huiming
Published in ECS transactions (01.10.2021)
Published in ECS transactions (01.10.2021)
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Journal Article
Backside Power Distribution for Nanosheet Technologies Beyond 2nm
Xie, Ruilong, Hong, Wonhyuk, Zhang, Chen, Lee, Jongjin, Brew, Kevin, Johnson, Richard, Lanzillo, Nicholas, Shobha, Hosadurga, Kim, Taesun, Park, Panjae, Mochizuki, Shogo, Saraf, Iqbal, Park, Chanro, Zhuang, Lei, Osborn, Clifford, Li, Wai Kin, Liu, Feng, Sankarapandian, Muthumanickam, Yang, Chung Ju, Li, Juntao, Tierney, Lukas, Pujari, Ruturaj, Sulehria, Yasir, Song, Yuncheng, Zhou, Huimei, Wang, Miaomiao, Belyansky, Michael, Ghosh, Somnath, Zhang, Haojun, Motoyama, Koichi, Sarkar, Debarghya, Kim, Wukang, Chu, Albert, Li, Tao, Carta, Fabio, Gluschenkov, Oleg, Oh, Joongsuk, Malley, Matthew, Chu, Pinlei, Nguyen, Son, Luedders, Katherine, Lee, Joe, Khan, Shahrukh, Chowdhury, Prabudhya Roy, Huang, Huai, Shadman, Abir, Sieg, Stuart, Dechene, Daniel, Edelstein, Daniel, Arnold, John, Yamashita, Tenko, Choi, Kisik, Seo, Kang-ill, Guo, Dechao, Bu, Huiming
Published in 2024 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (16.06.2024)
Published in 2024 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (16.06.2024)
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Conference Proceeding
Stress Liner Effects for 32-nm SOI MOSFETs With HKMG
Ming Cai, Ramani, Karthik, Belyansky, Michael, Greene, Brian, Lee, Doug H, Waidmann, Stephan, Tamweber, Frank, Henson, William
Published in IEEE transactions on electron devices (01.07.2010)
Published in IEEE transactions on electron devices (01.07.2010)
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Journal Article
Self-Allancd Gate Contact (SAGC) for CMOS technology scaling beyond 7nm
Xie, Ruilong, Park, Chanro, Conti, Richard, Robison, Robert, Zhou, Huimei, Saraf, Iqbal, Carr, Adra, Fan, Susan Su Chen, Ryan, Kevin, Belyansky, Michael, Pancharatnam, Shanti, Young, Albert, Wang, Junli, Greene, Andrew, Cheng, Kangguo, Li, Juntao, Conte, Richard, Tang, Hao, Choi, Kisik, Amanapu, Hari, Peethala, Brown, Muthinti, Raja, Raymond, Mark, Prindle, Christopher, Liang, Yong, Tsai, Stan, Kamineni, Vimal, Labonte, Andre, Cave, Nigel, Gupta, Dinesh, Basker, Veeraraghavan, Loubet, Nicolas, Guo, Dechao, Haran, Bala, Knorr, Andreas, Bu, Huiming
Published in 2019 Symposium on VLSI Technology (01.06.2019)
Published in 2019 Symposium on VLSI Technology (01.06.2019)
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Conference Proceeding
Atomic Layer Deposition of Sidewall Spacers: Process, Equipment and Integration Challenges in State-of-the-Art Logic Technologies
Belyansky, Michael P., Conti, Richard, Khan, Shahrukh, Zhou, Xin, Klymko, Nancy R, Yao, Yiping, Madan, Anita, Tai, Leo, Flaitz, Philip, Ando, Takashi
Published in ECS transactions (26.03.2014)
Published in ECS transactions (26.03.2014)
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Journal Article
Blanket SMT With In Situ N2 Plasma Treatment on the (100) Wafer for the Low-Cost Low-Power Technology Application
JUN YUAN, CHAN, Victor, BELYANSKY, Michael P, ELLER, Manfred, YONG MENG LEE, CAVE, Nigel, HUILING SHANG, YING LI, DIVAKARUNI, Rama, ROVEDO, Nivo, SARDESAI, Viraj, KANIKE, Narasimhulu, VARADARAJAN, Vidya, YU, Mickey, JONG HO YANG, JEONG, Y. K, SUNG KWON, O
Published in IEEE electron device letters (01.09.2009)
Published in IEEE electron device letters (01.09.2009)
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Journal Article
CARRIER WAFER WITH MULTIPLE ANTIREFLECTIVE COATING LAYERS
Belyansky, Michael P, Horibe, Akihiro, Knickerbocker, John, Chen, Qianwen
Year of Publication 23.03.2023
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Year of Publication 23.03.2023
Patent
Silicon handler with laser-release layers
John Knickerbocker, Qianwen Chen, Risa Miyazawa, Akihiro Horibe, Michael Belyansky, Takashi Hisada
Year of Publication 04.09.2024
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Year of Publication 04.09.2024
Patent