Fatigue Performance of Ball Grid Array Components at Elevated Temperature
Wei, Xin, Jian, Minghong, Amine Belhadi, Mohamed El, Hamasha, Sa'D, Suhling, Jeff, Lall, Pradeep
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
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Conference Proceeding
Investigating the Evolution of Creep Properties During Thermal Cycling of Homogeneous Lead-Free Solder Joints
Belhadi, Mohamed El Amine, Hamasha, Sa'd, Alahmer, Ali, Qasaimeh, Qais, Alakayleh, Abdallah, Alavi, Soroosh
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2023)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2023)
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Journal Article
Analysis and Modeling of Aged SAC-Bi Solder Joints Subjected to Varying Stress Cycling Conditions
Jian, Minghong, Hamasha, Sa'd, Alahmer, Ali, Hamasha, Mohammad, Wei, Xin, Belhadi, Mohamed El Amine, Hamasha, Khozima
Published in Materials (12.01.2023)
Published in Materials (12.01.2023)
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Journal Article
Comparative Drop Shock Reliability Study of SAC-Based Alloys in BGA Assemblies
Vyas, Palash Pranav, Alahmer, Ali, Alavi, Seyed Soroosh, Belhadi, Mohamed El Amine, Hamasha, Sa'd
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2024)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2024)
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Journal Article
Shear Fatigue Analysis of SAC-Bi Solder Joint Exposed to Varying Stress Cycling Conditions
Jian, Minghong, Hamasha, Sa'd, Alahmer, Ali, Wei, Xin, Belhadi, Mohamed El Amine, Alakayleh, Abdallah, Tahat, Sufyan
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2023)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2023)
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Journal Article
Effects of Multiple Reflows on IMC and Shear Strength of Individual Solder Joints
Tahat, Sufyan, Alakayleh, Abdallah, Belhadi, Mohamed El Amine, Alahmar, Ali, Yaeger, Alyssa, Hamasha, Sa'd
Published in 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (30.05.2023)
Published in 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (30.05.2023)
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Conference Proceeding
Effect of Solder Paste Alloy and Volume on Solder Voiding
Alakayleh, Abdallah, El Amine Belhadi, Mohamed, Tahat, Sufyan, HMasha, Ehab, Shmatok, Andrii, Alahmer, Ali, Hamasha, Sa'd
Published in 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (30.05.2023)
Published in 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (30.05.2023)
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Conference Proceeding
The Effect of Bi on the Mechanical Properties of Aged SAC Solder Joint
El Amine Belhadi, Mohamed, John Akkara, Francy, Athamenh, Raed, Abueed, Mohammed, Hamasha, Sa'd, Ali, Haneen, Suhling, Jeff, Lall, Pradeep
Published in 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.07.2020)
Published in 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.07.2020)
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Conference Proceeding
Micro Indentation Measurements of the Creep Properties of CABGA Doped Solder Joint
El Amine Belhadi, Mohamed, Akkara, Francy John, Hoque, Mohd Aminul, Vyas, Palash Pranav, Wei, Xin, Shmatok, Andrii, Hamasha, Sa'd, Prorok, Barton Charles, Suhling, Jeff, Lall, Pradeep
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
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Conference Proceeding
Fatigue Performance of Aged SAC-Bi Solder Joint under Varying Stress Cycling
Jian, Minghong, Vyas, Palash Pranav, Wei, Xin, El Amine Belhadi, Mohamed, Hamasha, Sa'd, Suhling, Jeff, Lall, Pradeep
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
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Conference Proceeding
Effect of Bi content and aging on solder joint shear properties considering strain rate
Belhadi, Mohamed El Amine, Hamasha, Sa'd, Alahmer, Ali
Published in Microelectronics and reliability (01.07.2023)
Published in Microelectronics and reliability (01.07.2023)
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Journal Article
Shear Strength Analysis of Aging SAC-Bi Solder Joints with Different Solder Paste Volumes
Pouya, Shaheen, Alahmer, Ali, Bolanos, Sergio, Tahat, Sufyan, Alalkayleh, Abdallah, El Amine Belhadi, Mohamed, Hamasha, Sa'd
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
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Conference Proceeding
Evaluating Shear Properties of Individual Solder Joints in Ball Grid Arrays: The Impact of Silver (Ag) and Bismuth (Bi) Content
Tarman, Wa'ad, Alahmer, Ali, Bolanos, Sergio, Pouya, Shaheen, Alakayleh, Abdallah, El Amine Belhadi, Mohamed, Hamasha, Sa'd
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
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Conference Proceeding
Aging Effect on Drop-Shock Reliability of SnAgCu305 Solder Alloy
Daradkeh, Saddam, Vyas, Palash Pranav, Alakayleh, Abdallah, El Amine Belhadi, Mohamed, Tahat, Sufyan, Alahmer, Ali, Hamasha, Sa'd
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
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Conference Proceeding
The Effect of Bi Content and Strain Rate on Tensile Properties of SnAgCu-Bi Alloys
Bolanos, Sergio, Alahmer, Ali, Alakayleh, Abdallah, Pouya, Shaheen, Vyas, Palash Pranav, El Amine Belhadi, Mohamed, Hamasha, Sa'd
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
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Conference Proceeding
Microhardness Analysis of Reflowed Solder Joints: Effect of Paste Alloy and Paste Volume
Alakayleh, Abdallah, Tahat, Sufyan, El Amine Belhadi, Mohamed, Bolanos, Sergio, Daradkeh, Saddam, Tarman, Waad, Qasaimeh, Qais, Alahmer, Ali, Hamasha, Sa'd
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
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Conference Proceeding