A Robust Thin-Film Wafer-Level Packaging Approach for MEMS Devices
Seetharaman, Krishnan, van Velzen, Bart, van Wingerden, Johannes, van Zadelhoff, Hans, Yuan, Cadmus, Rietveld, Frank, Tak, Coen, van Beek, Joost, Magnée, Peter H.C., Beijerinck, Herman C.W.
Published in Journal of microelectronics and electronic packaging (01.07.2010)
Published in Journal of microelectronics and electronic packaging (01.07.2010)
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