Extreme temperature 6H-SiC JFET integrated circuit technology
Neudeck, Philip G., Garverick, Steven L., Spry, David J., Chen, Liang-Yu, Beheim, Glenn M., Krasowski, Michael J., Mehregany, Mehran
Published in Physica status solidi. A, Applications and materials science (01.10.2009)
Published in Physica status solidi. A, Applications and materials science (01.10.2009)
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Journal Article
Prolonged 500 °C Demonstration of 4H-SiC JFET ICs With Two-Level Interconnect
Spry, David J., Neudeck, Philip G., Liangyu Chen, Lukco, Dorothy, Chang, Carl W., Beheim, Glenn M.
Published in IEEE electron device letters (01.05.2016)
Published in IEEE electron device letters (01.05.2016)
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Journal Article
Stable Electrical Operation of 6H-SiC JFETs and ICs for Thousands of Hours at 500 °C
NEUDECK, Philip G, SPRY, David J, PROKOP, Norman F, CHEN, Liang-Yu, BEHEIM, Glenn M, OKOJIE, Robert S, CHANG, Carl W, MEREDITH, Roger D, FERRIER, Terry L, EVANS, Laura J, KRASOWSKI, Michael J
Published in IEEE electron device letters (01.05.2008)
Published in IEEE electron device letters (01.05.2008)
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Journal Article
Processing and Prolonged 500 °C Testing of 4H-SiC JFET Integrated Circuits with Two Levels of Metal Interconnect
Lukco, Dorothy, Beheim, Glenn M., Spry, David J., Neudeck, Philip G., Chang, Carl W., Krasowski, Michael J., Prokop, Norman F., Chen, Liang Yu
Published in Materials Science Forum (24.05.2016)
Published in Materials Science Forum (24.05.2016)
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Journal Article
Prolonged 500°C Operation of 100+ Transistor Silicon Carbide Integrated Circuits
Chang, Carl W., Neudeck, Philip G., Beheim, Glenn M., Krasowski, Michael J., Prokop, Norman F., Chen, Liang Yu, Spry, David J., Lukco, Dorothy
Published in Materials science forum (05.06.2018)
Published in Materials science forum (05.06.2018)
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Journal Article
Experimentally observed electrical durability of 4H-SiC JFET ICs operating from 500 °C to 700 °C
Neudeck, Philip G., Spry, David J., Liangyu Chen, Lukco, Dorothy, Chang, Carl W., Beheim, Glenn M.
Published in 2016 European Conference on Silicon Carbide & Related Materials (ECSCRM) (15.05.2017)
Published in 2016 European Conference on Silicon Carbide & Related Materials (ECSCRM) (15.05.2017)
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Conference Proceeding
Journal Article
Evidence of Processing Non-Idealities in 4H-SiC Integrated Circuits Fabricated with Two Levels of Metal Interconnect
Neudeck, Philip G., Spry, David J., Evans, Laura J., Lukco, Dorothy, Chang, Carl W., Chen, Liang Yu, Beheim, Glenn M.
Published in Materials Science Forum (24.05.2016)
Published in Materials Science Forum (24.05.2016)
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Journal Article
Fracture strength of silicon carbide microspecimens
Sharpe, W.N., Jadaan, O., Beheim, G.M., Quinn, G.D., Nemeth, N.N.
Published in Journal of microelectromechanical systems (01.10.2005)
Published in Journal of microelectromechanical systems (01.10.2005)
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Journal Article
Stable Electrical Operation of 6H-SiC JFETs and ICs for Thousands of Hours at 500 ^\hbox
Neudeck, P.G., Spry, D.J., Liang-Yu Chen, Beheim, G.M., Okojie, R.S., Chang, C.W., Meredith, R.D., Ferrier, T.L., Evans, L.J., Krasowski, M.J., Prokop, N.F.
Published in IEEE electron device letters (01.05.2008)
Published in IEEE electron device letters (01.05.2008)
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Journal Article
Demonstration of a Packaged Capacitive Pressure Sensor System Suitable for Jet Turbofan Engine Health Monitoring
Scardelletti, Maximilian C., Jordan, Jennifer L., Meredith, Roger D., Harsh, Kevin, Pilant, Evan, Ursey, Michael W., Beheim, Glenn M., Hunter, Gary W., Zorman, Christian A.
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
Sixty Earth-Day Test of a Prototype Pt/HTCC Alumina Package in a Simulated Venus Environment
Chen, Liangyu, Neudeck, Philip G., Meredith, Roger D., Lukco, Dorothy, Spry, David J., Nakley, Leah M., Phillips, Kyle G., Beheim, Glenn M., Hunter, Gary W.
Published in Journal of microelectronics and electronic packaging (01.04.2019)
Published in Journal of microelectronics and electronic packaging (01.04.2019)
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Journal Article
Year-long 500°C Operational Demonstration of Up-scaled 4H-SiC JFET Integrated Circuits
Neudeck, Philip G., Spry, David J., Krasowski, Michael J., Prokop, Norman F., Beheim, Glenn M., Chen, Liang-Yu, Chang, Carl W.
Published in Journal of microelectronics and electronic packaging (01.10.2018)
Published in Journal of microelectronics and electronic packaging (01.10.2018)
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Journal Article
Wireless seismometer for venus
Ponchak, George E., Scardelletti, Maximilian C., Taylor, Brandt, Beard, Steve, Clougherty, Brian, Meredith, Roger D., Beheim, Glenn M., Kiefer, Walter S., Hunter, Gary W.
Published in 2014 IEEE Topical Conference on Wireless Sensors and Sensor Networks (WiSNet) (01.01.2014)
Published in 2014 IEEE Topical Conference on Wireless Sensors and Sensor Networks (WiSNet) (01.01.2014)
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Conference Proceeding
4H-SiC JFET Multilayer Integrated Circuit Technologies Tested up to 1000 K
Spry, David J, Neudeck, Phil G, Chen, Liangyu, Chang, Carl W, Lukco, Dorothy, Beheim, Glenn M.
Published in ECS transactions (21.09.2015)
Published in ECS transactions (21.09.2015)
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Journal Article
Experimentally Observed Electrical Durability of 4H-SiC JFET ICs Operating from 500 C to 700 C
Neudeck, Philip G, Spry, David J, Chen, Liangyu, Lukco, Dorothy, Chang, Carl W, Beheim, Glenn M
Published in NASA Center for AeroSpace Information (CASI). Conference Proceedings (25.09.2016)
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Published in NASA Center for AeroSpace Information (CASI). Conference Proceedings (25.09.2016)
Conference Proceeding
Electrical Performance of a High Temperature 32-I/O HTCC Alumina Package
Chen, Liang-Yu, Neudeck, Philip G, Spry, David J, Beheim, Glenn M, Hunter, Gary W
Published in NASA Center for AeroSpace Information (CASI). Conference Proceedings (10.05.2016)
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Published in NASA Center for AeroSpace Information (CASI). Conference Proceedings (10.05.2016)
Conference Proceeding
Experimental Durability Testing of 4H SiC JFET Integrated Circuit Technology at 727 C
Spry, David, Neudeck, Phil, Chen, Liangyu, Chang, Carl, Lukco, Dorothy, Beheim, Glenn M
Published in NASA Center for AeroSpace Information (CASI). Conference Proceedings (17.03.2016)
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Published in NASA Center for AeroSpace Information (CASI). Conference Proceedings (17.03.2016)
Conference Proceeding