On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers
Roshanghias, Ali, Dreissigacker, Marc, Scherf, Christina, Bretthauer, Christian, Rauter, Lukas, Zikulnig, Johanna, Braun, Tanja, Becker, Karl-F, Rzepka, Sven, Schneider-Ramelow, Martin
Published in Micromachines (Basel) (31.05.2020)
Published in Micromachines (Basel) (31.05.2020)
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Journal Article
Genetic Biopsy for Prediction of Surveillance Intervals after Endoscopic Resection of Colonic Polyps: Results of the GENESIS Study
Berger, Andreas W, Raedler, Katja, Langner, Cord, Ludwig, Leopold, Dikopoulos, Nektarios, Becker, Karl F, Slotta-Huspenina, Julia, Quante, Michael, Schwerdel, Daniel, Perkhofer, Lukas, Kleger, Alexander, Zizer, Eugen, Oswald, Franz, Seufferlein, Thomas, Meining, Alexander
Published in United European gastroenterology journal (01.03.2018)
Published in United European gastroenterology journal (01.03.2018)
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Journal Article
Exon skipping in the E-cadherin gene transcript in metastatic human gastric carcinomas
Becker, K F, Atkinson, M J, Reich, U, Huang, H H, Nekarda, H, Siewert, J R, Höfler, H
Published in Human molecular genetics (01.06.1993)
Published in Human molecular genetics (01.06.1993)
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Journal Article
The Realization of Redistribution Layers for FOWLP by Inkjet Printing
Ali Roshanghias, Ying Ma, Marc Dreissigacker, Tanja Braun, Christian Bretthauer, Karl-F. Becker, Martin Schneider-Ramelow
Published in Proceedings (01.12.2018)
Published in Proceedings (01.12.2018)
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Journal Article
Design of 77 GHz Interconnects for Buried SiGe MMICs Using Novel System-in-Package Technology
Richter, M.D., Becker, K.-F., Bottcher, L., Schneider, M.
Published in 2008 European Microwave Integrated Circuit Conference (01.10.2008)
Published in 2008 European Microwave Integrated Circuit Conference (01.10.2008)
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Conference Proceeding
Rapid Tooling for High Reliability Transfer Molded Devices
Becker, K.-F., Koch, M., Gramckow, J., Braun, T., Bader, V., Jung, E., Lang, K.-D., Aschenbrenner, R., Reichl, H.
Published in 2006 1st Electronic Systemintegration Technology Conference (01.09.2006)
Published in 2006 1st Electronic Systemintegration Technology Conference (01.09.2006)
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Conference Proceeding
Duromer MID technology for system-in-package generation : Polytronics
BECKER, Karl-F, BRAUN, Tanja, NEUMANN, Alexander, OSTMANN, Andreas, KOCH, M, BADER, V, ASCHENBRENNER, Rolf, REICHL, Herbert, JUNG, Erik
Published in IEEE transactions on electronics packaging manufacturing (2005)
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Published in IEEE transactions on electronics packaging manufacturing (2005)
Conference Proceeding
Duromer MID technology for system-in-package generation
Becker, K.-F., Braun, T., Neumann, A., Ostmann, A., Koch, M., Bader, V., Aschenbrenner, R., Reichl, H., Erik Jung
Published in IEEE transactions on electronics packaging manufacturing (01.10.2005)
Published in IEEE transactions on electronics packaging manufacturing (01.10.2005)
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Journal Article
Design of 77 GHz Interconnects for Buried SiGe MMICs Using Novel System-in-Package Technology
Richter, M.D., Becker, K.-F., Bottcher, L., Schneider, M.
Published in 2008 38th European Microwave Conference (01.10.2008)
Published in 2008 38th European Microwave Conference (01.10.2008)
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Conference Proceeding
Interconnects for Buried W-Band MMICs Using Novel System-in-Package Technology
Richter, M.D., Becker, K.F., Bottcher, L., Schneider, M.
Published in 2009 German Microwave Conference (01.03.2009)
Published in 2009 German Microwave Conference (01.03.2009)
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Conference Proceeding
Stackable system-on-packages with integrated components
Becker, K.-F., Erik Jung, Ostmann, A., Braun, T., Neumann, A., Aschenbrenner, R., Reichl, H.
Published in IEEE transactions on advanced packaging (01.05.2004)
Published in IEEE transactions on advanced packaging (01.05.2004)
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Journal Article
Advanced flip chip encapsulation: transfer molding process for simultaneous underfilling and postencapsulation
Becker, K.-F., Braun, T., Koch, M., Ansorge, F., Aschenbrenner, R., Reichl, H.
Published in First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) (2001)
Published in First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) (2001)
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Conference Proceeding