56 nm pitch Cu dual-damascene interconnects with self-aligned via using negative-tone development Lithography-Etch-Lithography-Etch patterning scheme
LOQUET, Yannick, MIGNOT, Yann, MORRIS, Bryan, KLEEMEIER, Walter, LINIGER, E, SPOONER, Terry, WASKIEWICZ, Christopher, CHEN, James Hsueh-Chung, SANKARAPANDIAN, Muthumanickam, CHEN, Shyng-Tsong, FLAITZ, Philip, TOMIZAWA, Hideyuki, TSENG, Chia-Hsun, BEARD, Marcy
Published in Microelectronic engineering (01.07.2013)
Published in Microelectronic engineering (01.07.2013)
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Conference Proceeding
Journal Article
56nm pitch Cu dual-damascene interconnects with self-aligned via using negative-tone development Lithography-Etch-Lithography-Etch patterning scheme
Loquet, Yannick, Mignot, Yann, Waskiewicz, Christopher, Chen, James Hsueh-Chung, Sankarapandian, Muthumanickam, Chen, Shyng-Tsong, Flaitz, Philip, Tomizawa, Hideyuki, Tseng, Chia-Hsun, Beard, Marcy, Morris, Bryan, Kleemeier, Walter, Liniger, E., Spooner, Terry
Published in Microelectronic engineering (01.07.2013)
Published in Microelectronic engineering (01.07.2013)
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Journal Article
48nm Pitch cu dual-damascene interconnects using self aligned double patterning scheme
Shyng-Tsong Chen, Tae-Soo Kim, Seo-woo Nam, Lafferty, Neal, Chiew-Seng Koay, Saulnier, Nicole, Wenhui Wang, Yongan Xu, Duclaux, Benjamin, Mignot, Yann, Beard, Marcy, Yunpeng Yin, Shobha, Hosadurga, Van der Straten, Oscar, Ming He, Kelly, James, Colburn, Matthew, Spooner, Terry
Published in 2013 IEEE International Interconnect Technology Conference - IITC (01.06.2013)
Published in 2013 IEEE International Interconnect Technology Conference - IITC (01.06.2013)
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Conference Proceeding
56 nm pitch copper dual-damascene interconnects with triple pitch split metal and double pitch split via
Chen, J. H.-C, Waskiewicz, C., Fan, S. S.-C, Halle, S., Chiew-seng Koay, Yongan Xu, Saulnier, N., Chia-Hsun Tseng, Yunpeng Yin, Mignot, Y., Beard, M., Morris, B., Horak, D., Mignot, S., Shobha, H., Sankarapandian, M., van der Straten, O., Kelly, J. J., Canaperi, D., Mclellan, E., Boye, C., Levin, T., Juntao Li, Demarest, J., Choi, S., Huang, E., Liemann, L., Haran, B., Arnold, J. C., Colburn, M., Clevenger, L., Spooner, T.
Published in 2012 IEEE International Interconnect Technology Conference (01.06.2012)
Published in 2012 IEEE International Interconnect Technology Conference (01.06.2012)
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Conference Proceeding