Semiconductor structure having buried conductive elements
BATRA POOJA R, ALPTEKIN EMRE, DIVAKARUNI RAMACHANDRA, CHENG KANGGUO, FALTERMEIER JOHNATHAN E, VEGA REINALDO A
Year of Publication 16.02.2016
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Year of Publication 16.02.2016
Patent
Semiconductor structure having buried conductive elements
BATRA POOJA R, ALPTEKIN EMRE, DIVAKARUNI RAMACHANDRA, CHENG KANGGUO, FALTERMEIER JOHNATHAN E, VEGA REINALDO A
Year of Publication 26.01.2016
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Year of Publication 26.01.2016
Patent
Combination of TSV and back side wiring in 3D integration
Winstel Kevin R, Iyer Subramanian S, La Tulipe, Jr. Douglas C, Golz John W, Skordas Spyridon, Batra Pooja R
Year of Publication 10.01.2017
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Year of Publication 10.01.2017
Patent
Combination of TSV and back side wiring in 3D integration
Winstel Kevin R, Iyer Subramanian S, La Tulipe, Jr. Douglas C, Golz John W, Skordas Spyridon, Batra Pooja R
Year of Publication 03.01.2017
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Year of Publication 03.01.2017
Patent
SEMICONDUCTOR STRUCTURE HAVING BURIED CONDUCTIVE ELEMENTS
BATRA POOJA R, ALPTEKIN EMRE, DIVAKARUNI RAMACHANDRA, CHENG KANGGUO, FALTERMEIER JOHNATHAN E, VEGA REINALDO A
Year of Publication 17.12.2015
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Year of Publication 17.12.2015
Patent
SEMICONDUCTOR STRUCTURE HAVING BURIED CONDUCTIVE ELEMENTS
BATRA POOJA R, ALPTEKIN EMRE, DIVAKARUNI RAMACHANDRA, CHENG KANGGUO, FALTERMEIER JOHNATHAN E, VEGA REINALDO A
Year of Publication 20.08.2015
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Year of Publication 20.08.2015
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COMBINATION OF TSV AND BACK SIDE WIRING IN 3D INTEGRATION
IYER SUBRAMANIAN S, BATRA POOJA R, LA TULIPE, JR. DOUGLAS C, WINSTEL KEVIN R, SKORDAS SPYRIDON, GOLZ JOHN W
Year of Publication 24.12.2015
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Year of Publication 24.12.2015
Patent
COMBINATION OF TSV AND BACK SIDE WIRING IN 3D INTEGRATION
IYER SUBRAMANIAN S, BATRA POOJA R, LA TULIPE, JR. DOUGLAS C, WINSTEL KEVIN R, SKORDAS SPYRIDON, GOLZ JOHN W
Year of Publication 02.07.2015
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Year of Publication 02.07.2015
Patent
Structure and method of manufacturing 3D integration scheme
DOUGLAS C. LA TULIPE JR, JOHN W. GOLZ, SPYRIDON SKORDAS, POOJA R. BATRA, SUBRAMANIAN S. IYER, KEVIN R. WINSTEL
Year of Publication 01.07.2015
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Year of Publication 01.07.2015
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