Silicide pre-clean effects on NiPtSi thermal stability for 65 nm technologies and beyond
Bonnetier, Susana, Imbert, Bruno, Hopstaken, Marco, Galpin, David, Gwoziecki, Romain, Barge, David, Zoll, Stéphane, Anilturk, Onder, Sicurani, Emmanuel, Caillat, Christian, Barr, Alex, Gonella, Roberto, Espinoux, Yannick, Mur, Pierre, Mayet, Nicolas, Gotti, Andrea, Basso, Marie-Thérèse
Published in Microelectronic engineering (01.11.2007)
Published in Microelectronic engineering (01.11.2007)
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Conference Proceeding
Pre-alloying implants with indium as an enabling technology to extend titanium salicide towards 0.1-μm linewidths
Gerritsen, Eric, Basso, Marie-Thérèse, Baylac, Bruno
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Published in Microelectronic engineering (2000)
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Low resistivity tungsten for contact metallization
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Published in Microelectronic engineering (01.12.2005)
Published in Microelectronic engineering (01.12.2005)
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Journal Article
Conference Proceeding
Silicide pre-clean effects on NiPtSi thermal stability for 65nm technologies and beyond
Bonnetier, Susana, Imbert, Bruno, Hopstaken, Marco, Galpin, David, Gwoziecki, Romain, Barge, David, Zoll, Stéphane, Anilturk, Onder, Sicurani, Emmanuel, Caillat, Christian, Barr, Alex, Gonella, Roberto, Espinoux, Yannick, Mur, Pierre, Mayet, Nicolas, Gotti, Andrea, Basso, Marie-Thérèse
Published in Microelectronic engineering (01.11.2007)
Published in Microelectronic engineering (01.11.2007)
Get full text
Journal Article