Characterization of copper layers grown by electrochemical mechanical deposition technique
Wang, Tony, Lindquist, Paul, Erdemli, Serkan, Basol, Erol C., Zhang, Richard, Uzoh, Cyprian E., Basol, Bulent M.
Published in Thin solid films (01.05.2005)
Published in Thin solid films (01.05.2005)
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Journal Article
Process and apparatus for air bubble removal during electrochemical processing
WANG HUNG-MING, CORNEJO MANUEL R, BOGART JEFFREY, ERDEMLI SERKAN, BASOL EROL C, BASOL BULENT M, AKSU SERDAR
Year of Publication 23.09.2004
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Year of Publication 23.09.2004
Patent