Thermal contact resistance and adhesion studies on thin copper films on alumina substrates
Sakami, D., Lahmar, A., Scudeller, Y., Danes, F., Bardon, J. P.
Published in Journal of adhesion science and technology (01.01.2001)
Published in Journal of adhesion science and technology (01.01.2001)
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Journal Article
Experimental route to heat conduction beyond the Fourier equation
Guillemet, P., Bardon, J.P., Rauch, C.
Published in International journal of heat and mass transfer (01.10.1997)
Published in International journal of heat and mass transfer (01.10.1997)
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Journal Article
Ohmic heating of complex fluids
El Moctar, A.Ould, Peerhossaini, H., Le Peurian, P., Bardon, J.P.
Published in International journal of heat and mass transfer (01.08.1993)
Published in International journal of heat and mass transfer (01.08.1993)
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Journal Article
Experimental study of heat transfer in oscillating flow
Bouvier, Pascale, Stouffs, Pascal, Bardon, Jean-Pierre
Published in International journal of heat and mass transfer (01.06.2005)
Published in International journal of heat and mass transfer (01.06.2005)
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Journal Article
Influence of speed and load on the thermal conductance of transport between the rings of bearing rollers
Bourouga, B, Briot, J M, Bardon, J P
Published in International journal of thermal sciences (01.07.2001)
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Published in International journal of thermal sciences (01.07.2001)
Journal Article