Cu Pillar Bump Development for 7-nm Chip Package Interaction (CPI) Technology
Fu, Lei, Bhagavat, Milind, Selvanayagam, Cheryl, Leong, Ken, Barber, Ivor
Published in Journal of microelectronics and electronic packaging (01.01.2020)
Published in Journal of microelectronics and electronic packaging (01.01.2020)
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Journal Article
몰딩된 칩 조합물
BHAGAVAT MILIND S, BARBER IVOR, AGARWAL RAHUL, LEONG CHIA KEN, FU LEI
Year of Publication 20.03.2020
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Year of Publication 20.03.2020
Patent
Semiconductor chip gettering
Cheng, Yuen Ting, Valliappan, Venkatachalam, Barber, Ivor, Agarwal, Rahul, Bhagavat, Milind S, Chok, Guan Sin
Year of Publication 19.07.2022
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Year of Publication 19.07.2022
Patent
Reliability evaluation of an extreme TSV interposer and interconnects for the 20nm technology CoWoS IC package
Banijamali, Bahareh, Lee, Tom, Liu, Henley, Ramalingam, Suresh, Barber, Ivor, Chang, Jonathan, Kim, Myongseob, Yip, Laurene
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding
A holistic view of chip-level thermal architecture from heterogeneous stacked dice to system level in telecoms applications
Refai-Ahmed, Gamal, Barber, Ivor, Torza, Anthony, Philofsky, Brian
Published in 2015 International 3D Systems Integration Conference (3DIC) (01.08.2015)
Published in 2015 International 3D Systems Integration Conference (3DIC) (01.08.2015)
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Conference Proceeding
MOLDED CHIP COMBINATION
BHAGAVAT, Milind S, FU, Lei, BARBER, Ivor, LEONG, Chia-Ken, AGARWAL, Rahul
Year of Publication 07.04.2021
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Year of Publication 07.04.2021
Patent
SEMICONDUCTOR CHIP GETTERING
CHENG, YUEN TING, BHAGAVAT, MILIND S, VALLIAPPAN, VENKATACHALAM, CHOK, GUAN SIN, AGARWAL, RAHUL, BARBER, IVOR
Year of Publication 18.02.2021
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Year of Publication 18.02.2021
Patent
Semiconductor chip gettering
Cheng, Yuen Ting, Valliappan, Venkatachalam, Barber, Ivor, Agarwal, Rahul, Bhagavat, Milind S, Chok, Guan Sin
Year of Publication 03.11.2020
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Year of Publication 03.11.2020
Patent
SEMICONDUCTOR CHIP GETTERING
Cheng, Yuen Ting, Valliappan, Venkatachalam, Barber, Ivor, Agarwal, Rahul, Bhagavat, Milind S, Chok, Guan Sin
Year of Publication 25.06.2020
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Year of Publication 25.06.2020
Patent
MOLDED CHIP COMBINATION
BHAGAVAT, Milind S, FU, Lei, BARBER, Ivor, LEONG, Chia-Ken, AGARWAL, Rahul
Year of Publication 17.06.2020
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Year of Publication 17.06.2020
Patent
Molded chip combination
Fu, Lei, Barber, Ivor, Leong, Chia-Ken, Agarwal, Rahul, Bhagavat, Milind S
Year of Publication 17.12.2019
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Year of Publication 17.12.2019
Patent
Chip package assembly with enhanced interconnects and method for fabricating the same
Ramalingam, Suresh, Lee, Tien-Yu, Liu, Henley, Barber, Ivor G, Gandhi, Jaspreet Singh
Year of Publication 11.06.2019
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Year of Publication 11.06.2019
Patent
MOLDED CHIP COMBINATION
BHAGAVAT, Milind S, FU, Lei, BARBER, Ivor, LEONG, Chia-Ken, AGARWAL, Rahul
Year of Publication 14.02.2019
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Year of Publication 14.02.2019
Patent
MOLDED CHIP COMBINATION
Fu, Lei, Barber, Ivor, Leong, Chia-Ken, Agarwal, Rahul, Bhagavat, Milind S
Year of Publication 14.02.2019
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Year of Publication 14.02.2019
Patent
Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal management
Ramalingam, Suresh, Lee, Tien-Yu, Kim, Myongseob, Liu, Henley, Refai-Ahmed, Gamal, Barber, Ivor G, Gandhi, Jaspreet Singh, Fernandez, Ferdinand F
Year of Publication 07.01.2020
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Year of Publication 07.01.2020
Patent
Testing system for lid-less integrated circuit packages
Mahoney, David M, Ramalingam, Suresh, Lee, Tien-Yu, Liu, Henley, Refai-Ahmed, Gamal, Barber, Ivor G, Mardi, Mohsen H, Gandhi, Jaspreet Singh
Year of Publication 07.01.2020
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Year of Publication 07.01.2020
Patent