Thermo-mechanical analysis of TSV and solder interconnects for different Cu pillar bump types
Park, SeMin, Bang, HanSur, Bang, HeeSeon, You, JaeSun
Published in Microelectronic engineering (01.11.2012)
Published in Microelectronic engineering (01.11.2012)
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내로우 갭 적용을 위한 핫와이어 송급 레이저용접 - 고속촬영을 통한 와이어 용융/이행 현상과 아크 포메이션 분석
Kim, Kyounghak, Bang, Hansur, Bang, Heeseon, Kaplan, Alexander F.H, Nasstrom, Jonas, Frostevarg, Jan
Published in Journal of welding and joining (01.10.2016)
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Published in Journal of welding and joining (01.10.2016)
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Correction to: Mechanical Properties of Dissimilar A356/SAPH440 Lap Joints by the Friction Stir Spot Welding and Self-Piercing Riveting
Bang, HeeSeon, Lee, W. R., Hong, Seong Min, Lee, S. Y., Song, J. H., Kim, J. M., Bang, HanSur
Published in Strength of materials (01.05.2018)
Published in Strength of materials (01.05.2018)
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Hot Wire Laser Welding of Multilayer for Narrow Gap - Analysis of Wire Melting/Transfer and Arc Formation Phenomenon by High Speed Imaging
Kim, Kyounghak, Bang, Hansur, Bang, Heeseon, Kaplan, Alexander F.H., Nasstrom, Jonas, Frostevarg, Jan
Published in Journal of Welding and Joining (31.10.2016)
Published in Journal of Welding and Joining (31.10.2016)
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