3D Self‐Assembled Microelectronic Devices: Concepts, Materials, Applications
Karnaushenko, Daniil, Kang, Tong, Bandari, Vineeth K., Zhu, Feng, Schmidt, Oliver G.
Published in Advanced materials (Weinheim) (01.04.2020)
Published in Advanced materials (Weinheim) (01.04.2020)
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High Mass Loading Asymmetric Micro-supercapacitors with Ultrahigh Areal Energy and Power Density
Zhu, Shijin, Li, Tianming, Bandari, Vineeth K, Schmidt, Oliver G, Gruschwitz, Markus, Tegenkamp, Christoph, Sommer, Michael, Choudhury, Soumyadip
Published in ACS applied materials & interfaces (15.12.2021)
Published in ACS applied materials & interfaces (15.12.2021)
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Bio‐Inspired Dynamically Morphing Microelectronics toward High‐Density Energy Applications and Intelligent Biomedical Implants
Merces, Leandro, Ferro, Letícia Mariê Minatogau, Thomas, Aleena, Karnaushenko, Dmitriy D., Luo, Yumin, Egunov, Aleksandr I., Zhang, Wenlan, Bandari, Vineeth K., Lee, Yeji, McCaskill, John S., Zhu, Minshen, Schmidt, Oliver G., Karnaushenko, Daniil
Published in Advanced materials (Weinheim) (01.06.2024)
Published in Advanced materials (Weinheim) (01.06.2024)
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Bio‐Inspired Dynamically Morphing Microelectronics toward High‐Density Energy Applications and Intelligent Biomedical Implants (Adv. Mater. 26/2024)
Merces, Leandro, Ferro, Letícia Mariê Minatogau, Thomas, Aleena, Karnaushenko, Dmitriy D., Luo, Yumin, Egunov, Aleksandr I., Zhang, Wenlan, Bandari, Vineeth K., Lee, Yeji, McCaskill, John S., Zhu, Minshen, Schmidt, Oliver G., Karnaushenko, Daniil
Published in Advanced materials (Weinheim) (01.06.2024)
Published in Advanced materials (Weinheim) (01.06.2024)
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