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Challenges of Scaling Down High-Power Performance Flip Chip Ball Grid Array (FCBGA) Package
Chan, W H, Lakhera, Nishant, Uehling, Trent, Bharatham, Logendran, Shantaram, Sandeep, Sukemi, Azham Mohd
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
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Reliability of BGAs and Mixed Low Temperature Solder Assemblies
Ghaffarian, Reza, Meilunas, Michael
Published in InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (30.05.2023)
Published in InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (30.05.2023)
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Conference Proceeding
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Comparison of FEA Modeling Techniques for Plastic Ball Grid Array Assemblies
Chen, Chienchih, Suhling, Jeffrey C., Lall, Pradeep
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.05.2018)
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.05.2018)
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Conference Proceeding
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Variable ball ball grid array (BGA) package
HARPER JAMES, RAVIKAR NACHIKET R, KLEIN SCOTT A, ZHANG JIEPING, MALATKAR PRAMOD, LU JIONGXIN, SOOD MOHIT, H ¨ 1 RTIS, ARKADIUSZ, LU XIAO, DEPPISCH CHRISTIAN, COMBS CHRISTOPHER
Year of Publication 25.06.2024
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Year of Publication 25.06.2024
Patent
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VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES
HUETTIS ALEXANDER, DEPPISCH CARL, ZHANG JIEPING, MALATKAR PRAMOD, LU JIONGXIN, SOOD MOHIT, HARPER JOHN, LU XIAO, COMBS CHRISTOPHER, RARAVIKAR NACHIKET R, KLEIN STEVEN A
Year of Publication 19.03.2021
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Year of Publication 19.03.2021
Patent
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